TMS320F28335 Series

C2000™ 32-bit MCU with 150 MIPS, FPU, 512 KB flash, EMIF, 12b ADC

Catalog

C2000™ 32-bit MCU with 150 MIPS, FPU, 512 KB flash, EMIF, 12b ADC

Part	Supplier Device Package	RAM Size	Program Memory Size	Core Size	Mounting Type	Oscillator Type	Program Memory Type	Data Converters [custom]	Data Converters [custom]	Package / Case	Peripherals	Operating Temperature [Min]	Operating Temperature [Max]	Speed	Number of I/O	Core Processor
Texas Instruments TMS320F28335PTPS	176-HLQFP (24x24)	34 K	512 KB	32-Bit Single-Core	Surface Mount	Internal	FLASH	16	12 b	176-LQFP Exposed Pad	DMA, POR, PWM, WDT	-40 °C	125 °C	150 MHz	88	C28x
Texas Instruments TMS320F28335PGFA	176-LQFP (24x24)	34 K	512 KB	32-Bit Single-Core	Surface Mount	Internal	FLASH	16	12 b	176-LQFP	DMA, POR, PWM, WDT	-40 °C	85 °C	150 MHz	88	C28x
Texas Instruments TMS320F28335ZJZA	176-BGA (15x15)	34 K	512 KB	32-Bit Single-Core	Surface Mount	Internal	FLASH	16	12 b	176-BGA	DMA, POR, PWM, WDT	-40 °C	85 °C	150 MHz	88	C28x
Texas Instruments TMS320F28335ZAYA	179-NFBGA (12x12)	34 K	512 KB	32-Bit Single-Core	Surface Mount	Internal	FLASH	16	12 b		DMA, POR, PWM, WDT	-40 °C	85 °C	150 MHz	88	C28x
Texas Instruments TMS320F28335ZJZS	176-BGA (15x15)	34 K	512 KB	32-Bit Single-Core	Surface Mount	Internal	FLASH	16	12 b	176-BGA	DMA, POR, PWM, WDT	-40 °C	125 °C	150 MHz	88	C28x

Catalog

C2000™ 32-bit MCU with 150 MIPS, FPU, 512 KB flash, EMIF, 12b ADC

Key Features

• High-performance static CMOS technologyUp to 150 MHz (6.67-ns cycle time)1.9-V/1.8-V core, 3.3-V I/O designHigh-performance 32-bit CPU (TMS320C28x)IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)16 × 16 and 32 × 32 MAC operations16 × 16 dual MACHarvard bus architectureFast interrupt response and processingUnified memory programming modelCode-efficient (in C/C++ and Assembly)Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)More than 2M × 16 address reachOn-chip memoryF28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAMF28334, F28234: 128K × 16 flash, 34K × 16 SARAMF28332, F28232: 64K × 16 flash, 26K × 16 SARAM1K × 16 OTP ROMBoot ROM (8K × 16)With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)Standard math tablesClock and system controlOn-chip oscillatorWatchdog timer moduleGPIO0 to GPIO63 pins can be connected to one of the eight external core interruptsPeripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts128-bit security key/lockProtects flash/OTP/RAM blocksPrevents firmware reverse-engineeringEnhanced control peripheralsUp to 18 PWM outputsUp to 6 HRPWM outputs with 150-ps MEP resolutionUp to 6 event capture inputsUp to 2 Quadrature Encoder interfacesUp to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)Three 32-bit CPU timersSerial port peripheralsUp to 2 CAN modulesUp to 3 SCI (UART) modulesUp to 2 McBSP modules (configurable as SPI)One SPI moduleOne Inter-Integrated Circuit (I2C) bus12-bit ADC, 16 channels80-ns conversion rate2 × 8 channel input multiplexerTwo sample-and-holdSingle/simultaneous conversionsInternal or external referenceUp to 88 individually programmable, multiplexed GPIO pins with input filteringJTAG boundary scan supportIEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan ArchitectureAdvanced debug featuresAnalysis and breakpoint functionsReal-time debug using hardwareDevelopment support includesANSI C/C++ compiler/assembler/linkerCode Composer Studio™ IDEDSP/BIOS™ and SYS/BIOSDigital motor control and digital power software librariesLow-power modes and power savingsIDLE, STANDBY, HALT modes supportedDisable individual peripheral clocksEndianness: Little endianPackage options:Lead-free, green packaging176-ball plastic Ball Grid Array (BGA) [ZJZ]179-ball MicroStar BGA™ [ZHH]179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]176-pin Low-Profile Quad Flatpack (LQFP) [PGF]176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]Temperature options:A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)S: –40°C to 125°C (PTP, ZJZ)Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)High-performance static CMOS technologyUp to 150 MHz (6.67-ns cycle time)1.9-V/1.8-V core, 3.3-V I/O designHigh-performance 32-bit CPU (TMS320C28x)IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)16 × 16 and 32 × 32 MAC operations16 × 16 dual MACHarvard bus architectureFast interrupt response and processingUnified memory programming modelCode-efficient (in C/C++ and Assembly)Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)More than 2M × 16 address reachOn-chip memoryF28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAMF28334, F28234: 128K × 16 flash, 34K × 16 SARAMF28332, F28232: 64K × 16 flash, 26K × 16 SARAM1K × 16 OTP ROMBoot ROM (8K × 16)With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)Standard math tablesClock and system controlOn-chip oscillatorWatchdog timer moduleGPIO0 to GPIO63 pins can be connected to one of the eight external core interruptsPeripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts128-bit security key/lockProtects flash/OTP/RAM blocksPrevents firmware reverse-engineeringEnhanced control peripheralsUp to 18 PWM outputsUp to 6 HRPWM outputs with 150-ps MEP resolutionUp to 6 event capture inputsUp to 2 Quadrature Encoder interfacesUp to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)Three 32-bit CPU timersSerial port peripheralsUp to 2 CAN modulesUp to 3 SCI (UART) modulesUp to 2 McBSP modules (configurable as SPI)One SPI moduleOne Inter-Integrated Circuit (I2C) bus12-bit ADC, 16 channels80-ns conversion rate2 × 8 channel input multiplexerTwo sample-and-holdSingle/simultaneous conversionsInternal or external referenceUp to 88 individually programmable, multiplexed GPIO pins with input filteringJTAG boundary scan supportIEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan ArchitectureAdvanced debug featuresAnalysis and breakpoint functionsReal-time debug using hardwareDevelopment support includesANSI C/C++ compiler/assembler/linkerCode Composer Studio™ IDEDSP/BIOS™ and SYS/BIOSDigital motor control and digital power software librariesLow-power modes and power savingsIDLE, STANDBY, HALT modes supportedDisable individual peripheral clocksEndianness: Little endianPackage options:Lead-free, green packaging176-ball plastic Ball Grid Array (BGA) [ZJZ]179-ball MicroStar BGA™ [ZHH]179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]176-pin Low-Profile Quad Flatpack (LQFP) [PGF]176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]Temperature options:A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)S: –40°C to 125°C (PTP, ZJZ)Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

Description

C2000™ real-time microcontrollersare optimized for processing, sensing, and actuation to improve closed-loop performance inreal-time control applicationssuch asindustrial motor drives;solar inverters and digital power;electrical vehicles and transportation;motor control; andsensing and signal processing. The C2000 line includes thePremium performance MCUsand theEntry performance MCUs. The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications. Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device. TheGetting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guidecovers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered. To learn more about the C2000 MCUs, visit theC2000™ real-time control MCUspage. C2000™ real-time microcontrollersare optimized for processing, sensing, and actuation to improve closed-loop performance inreal-time control applicationssuch asindustrial motor drives;solar inverters and digital power;electrical vehicles and transportation;motor control; andsensing and signal processing. The C2000 line includes thePremium performance MCUsand theEntry performance MCUs. The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications. Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device. TheGetting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guidecovers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered. To learn more about the C2000 MCUs, visit theC2000™ real-time control MCUspage.