28-526 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS TIN
| Part | Contact Finish - Mating | Contact Finish - Post | Type | Contact Material - Post | Mounting Type | Contact Finish Thickness - Mating | Termination | Pitch - Post | Housing Material | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Contact Material - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Mating | Features | Contact Finish Thickness - Post | Current Rating | Termination Post Length | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | Tin | Tin | DIP ZIF (ZIP) | Beryllium Copper | Through Hole | 10 µin | Solder | 0.1 in | Glass Filled Nylon 4/6 PA46 Polyamide | 14 | 28 | 2 | Beryllium Copper | -55 °C | 105 °C | 0.1 in | Closed Frame | 10 µin | 3 A | 0.105 in | UL94 V-0 |
 Aries Electronics | Gold | Gold | DIP ZIF (ZIP) | Beryllium Copper | Through Hole | 10 µin | Solder | 0.1 in | Glass Filled Nylon 4/6 PA46 Polyamide | 14 | 28 | 2 | Beryllium Copper | -55 °C | 125 °C | 0.1 in | Closed Frame | 10 µin | 3 A | 0.105 in | UL94 V-0 |