28-526 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS TIN

Part	Contact Finish - Post	Housing Material	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Features	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Termination	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish - Mating
Aries Electronics 28-526-10	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	0.105 in	2.67 mm	28	Closed Frame	UL94 V-0	3 A	Through Hole	Beryllium Copper	10 çin	0.25 çm	0.1 in	2.54 mm	DIP ZIF (ZIP)	10 çin	0.25 çm	105 ░C	-55 °C	Solder	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 28-526-11	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	0.105 in	2.67 mm	28	Closed Frame	UL94 V-0	3 A	Through Hole	Beryllium Copper	10 çin	0.25 çm	0.1 in	2.54 mm	DIP ZIF (ZIP)	10 çin	0.25 çm	125 °C	-55 °C	Solder	2.54 mm	0.1 in	Beryllium Copper	Gold