74LVTZ244 Series

8-ch, 2.7-V to 3.6-V buffers with bus-hold, TTL-compatible CMOS inputs and 3-state outputs

Catalog(3 parts)

Part	Number of Bits per Element▲▼	Output Type	Operating Temperature▲▼	Operating Temperature▲▼	Current - Output High, Low▲▼	Voltage - Supply▲▼	Voltage - Supply▲▼	Number of Elements▲▼	Supplier Device Package	Logic Type	Mounting Type	Package / Case▲▼	Package / Case
Texas Instruments SN74LVTZ244DBR Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SSOP	4 ul	3-State	85 °C	-40 °C	0.03200000151991844 A, 0.06400000303983688 A	2.700000047683716 V	3.5999999046325684 V	2 ul	20-SSOP	Buffer, Non-Inverting	Surface Mount	0.0052999998442828655 m, 0.005308600142598152 m	20-SSOP
Texas Instruments SN74LVTZ244DW Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SOIC	4 ul	3-State	85 °C	-40 °C	0.03200000151991844 A, 0.06400000303983688 A	2.700000047683716 V	3.5999999046325684 V	2 ul	20-SOIC	Buffer, Non-Inverting	Surface Mount	0.007493000011891127 m, 0.007499999832361937 m	20-SOIC
Texas Instruments SN74LVTZ244DWR Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SOIC	4 ul	3-State	85 °C	-40 °C	0.03200000151991844 A, 0.06400000303983688 A	2.700000047683716 V	3.5999999046325684 V	2 ul	20-SOIC	Buffer, Non-Inverting	Surface Mount	0.007493000011891127 m, 0.007499999832361937 m	20-SOIC

Key Features

• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power DissipationHigh-Impedance State During Power Up and Power DownSupport Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Support Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)< 0.8 V at VCC= 3.3 V, TA= 25°CLatch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17Bus-Hold Data Inputs Eliminate the Need for External Pullup ResistorsPackage Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPsState-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power DissipationHigh-Impedance State During Power Up and Power DownSupport Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Support Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)< 0.8 V at VCC= 3.3 V, TA= 25°CLatch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17Bus-Hold Data Inputs Eliminate the Need for External Pullup ResistorsPackage Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPs

Description

These octal buffers/drivers are designed specifically for low-voltage (3.3-V) VCCoperation with the capability to provide a TTL interface to a 5-V system environment. These devices are organized as two 4-bit line drivers with separate output-enable () inputs. Whenis low, the device passes data from the A inputs to the Y outputs. Whenis high, the outputs are in the high-impedance state. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54LVTZ244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTZ244 is characterized for operation from -40°C to 85°C. These octal buffers/drivers are designed specifically for low-voltage (3.3-V) VCCoperation with the capability to provide a TTL interface to a 5-V system environment. These devices are organized as two 4-bit line drivers with separate output-enable () inputs. Whenis low, the device passes data from the A inputs to the Y outputs. Whenis high, the outputs are in the high-impedance state. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54LVTZ244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTZ244 is characterized for operation from -40°C to 85°C.