TMS-106 Series
Manufacturer: Samtec Inc.
.050" (1.27MM) MICRO HEADER
| Part | Number of Positions | Contact Length - Post | Contact Finish - Post | Contact Shape | Connector Type | Mounting Type | Fastening Type | Contact Material | Contact Length - Mating | Number of Rows | Contact Type | Shrouding | Termination | Current Rating (Per Contact) | Overall Contact Length | Insulation Color | Pitch - Mating | Style | Insulation Height | Operating Temperature (Max) | Operating Temperature (Min) | Material Flammability Rating | Number of Positions Loaded | Insulation Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Row Spacing - Mating | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 6 | 0.12 in | Tin | Square | Header | Through Hole | Push-Pull | Phosphor Bronze | 0.1 in | 1 | Male Pin | Unshrouded | Solder | 5 A | 0.32 in | Black | 0.05 in | Board | 0.1 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 3 µin | |||
Samtec Inc. | |||||||||||||||||||||||||||||
Samtec Inc. | 6 | 0.12 in | Gold | Square | Header | Through Hole | Push-Pull | Phosphor Bronze | 0.23 in | 1 | Male Pin | Unshrouded | Solder | 5 A | 0.45 in | Black | 0.05 in | Board | 0.1 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 10 µin | 3 µin | ||
Samtec Inc. | 6 | 0.14 in | Tin | Square | Header | Right Angle Through Hole | Push-Pull | Phosphor Bronze | 0.1 in | 1 | Male Pin | Unshrouded | Solder | 5 A | Black | 0.05 in | Board | 0.098 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 30 µin | ||||
Samtec Inc. | 12 | 0.175 in | Tin | Square | Header | Through Hole | Push-Pull | Phosphor Bronze | 0.23 in | 2 | Male Pin | Unshrouded | Solder | 5 A | 0.505 in | Black | 0.05 in | Board | 0.1 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 30 µin | 0.1 in | ||
Samtec Inc. | 12 | 0.12 in | Gold | Square | Header | Through Hole | Push-Pull | Phosphor Bronze | 0.19 in | 2 | Male Pin | Unshrouded | Solder | 5 A | 0.41 in | Black | 0.05 in | Board | 0.1 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 10 µin | 3 µin | 0.1 in | |
Samtec Inc. | 12 | 0.12 in | Tin | Square | Header | Through Hole | Push-Pull | Phosphor Bronze | 0.1 in | 2 | Male Pin | Unshrouded | Solder | 5 A | 0.32 in | Black | 0.05 in | Board | 0.1 in | 125 °C | -55 °C | UL94 V-0 | All | Liquid Crystal Polymer (LCP) | Gold | 30 µin | 0.1 in | ||
Samtec Inc. | 12 | Gold | Square | Header | Right Angle Through Hole | Push-Pull | Phosphor Bronze | 2 | Male Pin | Unshrouded | Solder | Black | 0.05 in | Board | 125 °C | -55 °C | UL94 V-0 | Liquid Crystal Polymer (LCP) | Gold | ||||||||||
Samtec Inc. | |||||||||||||||||||||||||||||
Samtec Inc. | 6 | 0.14 in | Tin | Square | Header | Right Angle Through Hole | Push-Pull | Phosphor Bronze | 0.1 in | 1 | Male Pin | Unshrouded | Solder | 5 A | Black | 0.05 in | Board | 0.098 in | 125 °C | -55 °C | UL94 V-0 | Liquid Crystal Polymer (LCP) | Gold | 3 µin | 5 |