Catalog(3 parts)
| Part | Number of Inputs▲▼ | Supplier Device Package | Number of Circuits▲▼ | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Input Logic Level - Low▲▼ | Input Logic Level - Low▲▼ | Current - Quiescent (Max)▲▼ | Logic Type | Current - Output High, Low▲▼ | Current - Output High, Low▲▼ | Input Logic Level - High▲▼ | Input Logic Level - High▲▼ | Mounting Type | Package / Case | Operating Temperature▲▼ | Operating Temperature▲▼ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3 ul | 6-DSBGA | 1 ul | 5.5 V | 1.649999976158142 V | 0.800000011920929 V | 0.699999988079071 V | 0.000009999999747378752 A | NAND Gate | 0.03200000151991844 A | 0.03200000151991844 A | 1.7000000476837158 V | 2 V | Surface Mount | 6-XFBGA, DSBGA | -40 °C | 85 °C | |
3 ul | SC-70-6 | 1 ul | 5.5 V | 1.649999976158142 V | 0.800000011920929 V | 0.699999988079071 V | 0.000009999999747378752 A | NAND Gate | 0.03200000151991844 A | 0.03200000151991844 A | 1.7000000476837158 V | 2 V | Surface Mount | 6-TSSOP, SC-88, SOT-363 | -40 °C | 125 °C | |
3 ul | 6-SON (1x1) | 1 ul | 5.5 V | 1.649999976158142 V | 0.800000011920929 V | 0.699999988079071 V | 0.000009999999747378752 A | NAND Gate | 0.03200000151991844 A | 0.03200000151991844 A | 1.7000000476837158 V | 2 V | Surface Mount | 6-XFDFN | -40 °C | 125 °C |
Key Features
• Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VProvides Down Translation to VCCMax tpdof 3.8 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VProvides Down Translation to VCCMax tpdof 3.8 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged Device Model (C101)
Description
AI
The SN74LVC1G10 performs the Boolean function Y =A • B • Cor Y =A+B+Cin positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The SN74LVC1G10 performs the Boolean function Y =A • B • Cor Y =A+B+Cin positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.