TFM-125-01-H-D-RE1-WT

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Samtec Inc.

CONN HEADER R/A 50POS 1.27MM

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TFM-125-01-H-D-RE1-WT

Active

Samtec Inc.

CONN HEADER R/A 50POS 1.27MM

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Technical Specifications

Parameters and characteristics for this part

Specification	TFM-125-01-H-D-RE1-WT

Connector Type	Elevated, Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	0.139 in
Contact Length - Mating	3.53 mm
Contact Length - Post [x]	0.078 in
Contact Length - Post [x]	1.98 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	0.24 in
Insulation Height	6.1 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	50
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Row Spacing - Mating	0.05 in
Row Spacing - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	275 VAC

TFM-125 Series

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Part	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Height	Insulation Height	Termination	Style	Contact Finish - Mating	Voltage Rating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Material	Current Rating (Amps)	Fastening Type	Connector Type	Contact Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Number of Rows	Contact Length - Mating	Contact Length - Mating	Insulation Color	Contact Finish - Post	Features	Pitch - Mating	Pitch - Mating	Number of Positions Loaded	Material Flammability Rating	Contact Shape	Contact Material	Shrouding	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Post	Contact Length - Post
Samtec Inc. TFM-125-02-L-D-A-K-TR	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	15 µin	0.38 µm	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.33 mm	0.131 in	Black	Tin	Board Guide Pick and Place	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-01-H-D-RE1-WT	-55 °C	125 °C	6.1 mm	0.24 in	Solder	Board to Board Cable	Gold	275 VAC	Through Hole Right Angle	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Elevated Header	Male Pin	0.05 in	1.27 mm	50	2	3.53 mm	0.139 in	Black	Gold	Solder Retention	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall	3 µin	0.076 µm	0.078 in	1.98 mm
Samtec Inc. TFM-125-02-H-D-LC-K	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.33 mm	0.131 in	Black	Gold	Board Lock Pick and Place	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall	3 µin	0.076 µm
Samtec Inc. TFM-125-12-L-D-K	-55 °C	125 °C	7.37 mm	0.29 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	15 µin	0.38 µm	Liquid Crystal Polymer (LCP)	2.9 A 3.2 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.53 mm	0.139 in	Black	Tin	Pick and Place	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-13-L-D-A-K	-55 °C	125 °C	7.37 mm	0.29 in	Solder	Board to Board Cable	Gold	275 VAC	Through Hole	15 µin	0.38 µm	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.53 mm	0.139 in	Black	Tin	Board Guide Pick and Place	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall					0.111 in	2.82 mm
Samtec Inc. TFM-125-02-S-D	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.33 mm	0.131 in	Black	Tin		0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-32-S-D-LC-K	-55 °C	125 °C	11.05 mm	0.435 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.53 mm	0.139 in	Black	Tin	Board Lock Pick and Place	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-02-S-S-A	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin				1	3.33 mm	0.131 in	Black	Tin	Board Guide	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-02-S-D-WT-K-TR	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.33 mm	0.131 in	Black	Tin	Pick and Place Solder Retention	0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall
Samtec Inc. TFM-125-02-L-D-TR	-55 °C	125 °C	5.6 mm	0.22 in	Solder	Board to Board Cable	Gold	275 VAC	Surface Mount	15 µin	0.38 µm	Liquid Crystal Polymer (LCP)	2.9 A	Push-Pull	Header	Male Pin	0.05 in	1.27 mm	50	2	3.33 mm	0.131 in	Black	Tin		0.05 in	1.27 mm	All	UL94 V-0	Square	Phosphor Bronze	Shrouded - 4 Wall

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 10.53

Description

General part information

TFM-125 Series

Connector Header Through Hole, Right Angle 50 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available