Part	Mounting Type	Contact Finish Thickness - Mating	Current Rating (Per Contact)	Insulation Height	Termination	Contact Finish - Mating	Style	Contact Length - Mating	Number of Rows	Contact Length - Post	Material Flammability Rating	Contact Shape	Contact Material	Number of Positions	Insulation Color	Shrouding	Insulation Material	Connector Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Post	Fastening Type	Contact Type	Number of Positions Loaded	Overall Contact Length	Pitch - Mating	Row Spacing - Mating	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. TMS-120-53-S-S	Through Hole	30 µin	5 A	0.1 in	Solder	Gold	Board	0.285 in	1	0.12 in	UL94 V-0	Square	Phosphor Bronze	20	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Tin	Push-Pull	Male Pin	All	0.505 in	0.05 in
Samtec Inc. TMS-108-55-G-S	Through Hole				Solder	Gold	Board		1		UL94 V-0	Square	Phosphor Bronze	8	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Gold	Push-Pull	Male Pin			0.05 in
Samtec Inc. TMS-107-52-T-S	Through Hole		5 A	0.1 in	Solder	Tin	Board	0.205 in	1	0.12 in	UL94 V-0	Square	Phosphor Bronze	7	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	105 °C	-55 °C	Tin	Push-Pull	Male Pin	All	0.425 in	0.05 in
Samtec Inc. TMS-110-02-T-S	Through Hole		5 A	0.1 in	Solder	Tin	Board	0.1 in	1	0.12 in	UL94 V-0	Square	Phosphor Bronze	10	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	105 °C	-55 °C	Tin	Push-Pull	Male Pin	All	0.32 in	0.05 in
Samtec Inc. TMS-118-21-S-D	Through Hole	30 µin	5 A	0.1 in	Solder	Gold	Board	0.23 in	2	0.175 in	UL94 V-0	Square	Phosphor Bronze	36	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Tin	Push-Pull	Male Pin	All	0.505 in	0.05 in	0.1 in
Samtec Inc. TMS-125-02-G-S-RA	Right Angle Through Hole	10 µin	5 A	0.098 in	Solder	Gold	Board	0.1 in	1	0.14 in	UL94 V-0	Square	Phosphor Bronze	25	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Cuttable Header	125 °C	-55 °C	Gold	Push-Pull	Male Pin	All		0.05 in
Samtec Inc. TMS-134-54-G-D	Through Hole	10 µin	5 A	0.1 in	Solder	Gold	Board	0.335 in	2	0.12 in	UL94 V-0	Square	Phosphor Bronze	68	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Gold	Push-Pull	Male Pin	All	0.555 in	0.05 in	0.1 in	3 µin
Samtec Inc. TMS-113-01-S-D-024	Through Hole	30 µin	5 A	0.1 in	Solder	Gold	Board	0.23 in	2	0.12 in	UL94 V-0	Square	Phosphor Bronze	26	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Tin	Push-Pull	Male Pin		0.45 in	0.05 in	0.1 in		25
Samtec Inc. TMS-103-58-S-S
Samtec Inc. TMS-115-58-G-D	Through Hole				Solder	Gold	Board		2		UL94 V-0	Square	Phosphor Bronze	30	Black	Unshrouded	Liquid Crystal Polymer (LCP)	Header	125 °C	-55 °C	Gold	Push-Pull	Male Pin			0.05 in

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CAD

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Documents

Technical documentation and resources

Product Drawing (PDF)

TMS Datasheet

Through-hole Micro Header, 0.050" x 0.100" Pitch

TMS-115-02-L-S-RA | Datasheet