Zenode.ai Logo
Beta
K
SH63N65DM6AG - STMICROELECTRONICS SH32N65DM6AG

SH63N65DM6AG

Active
STMicroelectronics

AUTOMOTIVE-GRADE N-CHANNEL 650 V, 56 MOHM TYP., 53 A MDMESH DM6 POWER MOSFET IN AN ACEPACK SMIT PACKAGE

Deep-Dive with AI

Search across all available documentation for this part.

SH63N65DM6AG - STMICROELECTRONICS SH32N65DM6AG

SH63N65DM6AG

Active
STMicroelectronics

AUTOMOTIVE-GRADE N-CHANNEL 650 V, 56 MOHM TYP., 53 A MDMESH DM6 POWER MOSFET IN AN ACEPACK SMIT PACKAGE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSH63N65DM6AG
Configuration2 N-Channel (Half Bridge)
Current - Continuous Drain (Id) @ 25°C53 A
Drain to Source Voltage (Vdss)650 V
Gate Charge (Qg) (Max) @ Vgs80 nC
Input Capacitance (Ciss) (Max) @ Vds3344 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case9-PowerSMD
Power - Max [Max]424 W
Rds On (Max) @ Id, Vgs64 mOhm
Supplier Device Package9-ACEPACK SMIT
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id4.75 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 26.32
10$ 23.38
100$ 20.45
Digi-Reel® 1$ 26.32
10$ 23.38
100$ 20.45
Tape & Reel (TR) 200$ 20.45
400$ 19.09
NewarkEach (Supplied on Cut Tape) 1$ 35.81
10$ 28.83
25$ 28.82
50$ 27.50
100$ 26.17
400$ 26.16

Description

General part information

SH63N65DM6AG Series

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.