
BR25H512FJ-5ACE2
ActiveRohm Semiconductor
EEPROM SERIAL-SPI 512K-BIT 64K X 8 1.8V/2.5V/3.3V/5V AUTOMOTIVE AEC-Q100 8-PIN SOP-J T/R

BR25H512FJ-5ACE2
ActiveRohm Semiconductor
EEPROM SERIAL-SPI 512K-BIT 64K X 8 1.8V/2.5V/3.3V/5V AUTOMOTIVE AEC-Q100 8-PIN SOP-J T/R
Description
General part information
BR25H512FJ-5AC Series
BR25H512xxx-5AC Series is a 512Kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H512FJ-5ACE2 |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 64 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 64 kB |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.154 in |
| Package Name | 8-SOIC, 8-SOP-J |
| Package Width | 3.9 mm |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Five Steps for Successful Thermal Design of IC
Design Guide and Example of Stencil for Exposed Pad
Thermal Resistance
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor
Solder Joint Rate and Thermal Resistance of Exposed Pad
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Basics of Thermal Resistance and Heat Dissipation
SOP-J8 Package Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What Is Thermal Design
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Factory Information