RBQ10BM100AFHTL
ActiveRohm Semiconductor
LOW IR, 100V, 10A, TO-252 (DPAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
RBQ10BM100AFHTL
ActiveRohm Semiconductor
LOW IR, 100V, 10A, TO-252 (DPAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
Description
General part information
RBQ10 Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBQ10BM100AFHTL |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 10 A |
| Current - Reverse Leakage | 80 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Package Name | TO-252 |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 770 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Report of SVHC under REACH Regulation
List of Diode Package Thermal Resistance
How to Use LTspice® Models
What Is Thermal Design
About Export Regulations
How to Create Symbols for PSpice Models
Package Dimensions
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Measurement Method and Usage of Thermal Resistance RthJC
How to Select Rectifier Diodes
Anti-Whisker formation - Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
Importance of Probe Calibration When Measuring Power: Deskew
Diode Types and Applications
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Use LTspice® Models: Tips for Improving Convergence
Impedance Characteristics of Bypass Capacitor
Absolute Maximum Rating and Electrical Characteristics of Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Condition of Soldering / Land Pattern Reference
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Explanation for Marking
Compliance of the RoHS directive
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
PCB Layout Thermal Design Guide
Basics of Thermal Resistance and Heat Dissipation
Two-Resistor Model for Thermal Simulation
Moisture Sensitivity Level - Diodes
Judgment Criteria of Thermal Evaluation
Reliability Test Result
Diode Selection Method for Asynchronous Converter
Method for Monitoring Switching Waveform
How to Select Reverse Current Protection Diodes for LDO Regulators
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Power Loss and Thermal Design of Diodes
Notes for Calculating Power Consumption:Static Operation
What is a Thermal Model? (Diode)
Inner Structure
About Flammability of Materials
Taping Information
Notes for Temperature Measurement Using Thermocouples
Electrical Static Discharge Immunity
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Part Explanation
