44-6556-41

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Aries Electronics

CONN IC DIP SOCKET 44POS GOLD

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44-6556-41

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Aries Electronics

CONN IC DIP SOCKET 44POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	44-6556-41

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	44 Positions or Pins
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination Post Length	0.18 in
Termination Post Length	4.57 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

44-6556 Series

Part	Mounting Type	Termination Post Length	Termination Post Length	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Post	Contact Finish - Mating	Current Rating (Amps)	Number of Positions or Pins (Grid)	Material Flammability Rating	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Material - Mating
Aries Electronics 44-6556-11	Through Hole	3.3 mm	0.13 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Solder	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-10	Through Hole	3.3 mm	0.13 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Solder	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-20	Through Hole	7.19 mm	0.283 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-31	Through Hole	10.74 mm	0.423 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-40	Through Hole	4.57 mm	0.18 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame		30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-41	Through Hole	4.57 mm	0.18 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame		30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-30	Through Hole	10.74 mm	0.423 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	7	$ 66.24

Description

General part information

44-6556 Series

44 (2 x 22) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources