529901B02500G

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Boyd Laconia, LLC

HEATSINK TO-218 SOLDER PIN

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Boyd Laconia, LLC

HEATSINK TO-218 SOLDER PIN

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	529901B02500G	529901 Series

Attachment Method	PC Pin, Bolt On	PC Pin, Bolt On
Fin Height	1 in	1 in
Fin Height	25.4 mm	25.4 mm
Length	50.8 mm	50.8 mm
Length	2 in	2 in
Material	Aluminum	Aluminum
Material Finish	Black Anodized	Black Anodized
Package Cooled	TO-218	TO-218
Power Dissipation @ Temperature Rise	12 W	12 W
Shape	Rectangular, Fins	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	1 °C/W	1 °C/W
Thermal Resistance @ Natural	4.5 °C/W	4.5 °C/W
Type	Board Level, Vertical	Board Level, Vertical
Width [x]	41.91 mm	41.91 mm
Width [x]	1.65 in	1.65 in

HEATSINK TO-218 SOLDER PIN

Part	Width [x]	Width [x]	Thermal Resistance @ Natural	Power Dissipation @ Temperature Rise	Attachment Method	Type	Length	Length	Shape	Fin Height	Fin Height	Material	Package Cooled	Thermal Resistance @ Forced Air Flow	Material Finish
Boyd Laconia, LLC 529901B02500G	41.91 mm	1.65 in	4.5 °C/W	12 W	Bolt On, PC Pin	Board Level, Vertical	50.8 mm	2 in	Rectangular, Fins	1 in	25.4 mm	Aluminum	TO-218	1 °C/W	Black Anodized
Boyd Laconia, LLC 529901B02100G	41.91 mm	1.65 in	4.5 °C/W	12 W	Bolt On, PC Pin	Board Level, Vertical	50.8 mm	2 in	Rectangular, Fins	1 in	25.4 mm	Aluminum	TO-218	1 °C/W	Black Anodized

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly