529901B02100G

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	529901B02100G	529901 Series

Attachment Method	PC Pin, Bolt On	PC Pin, Bolt On
Fin Height	1 in	1 in
Fin Height	25.4 mm	25.4 mm
Length	50.8 mm	50.8 mm
Length	2 in	2 in
Material	Aluminum	Aluminum
Material Finish	Black Anodized	Black Anodized
Package Cooled	TO-218	TO-218
Power Dissipation @ Temperature Rise	12 W	12 W
Shape	Rectangular, Fins	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	1 °C/W	1 °C/W
Thermal Resistance @ Natural	4.5 °C/W	4.5 °C/W
Type	Board Level, Vertical	Board Level, Vertical
Width [x]	41.91 mm	41.91 mm
Width [x]	1.65 in	1.65 in

HEATSINK TO-218 SOLDER PIN

Part	Width [x]	Width [x]	Thermal Resistance @ Natural	Power Dissipation @ Temperature Rise	Attachment Method	Type	Length	Length	Shape	Fin Height	Fin Height	Material	Package Cooled	Thermal Resistance @ Forced Air Flow	Material Finish
Boyd Laconia, LLC 529901B02500G	41.91 mm	1.65 in	4.5 °C/W	12 W	Bolt On, PC Pin	Board Level, Vertical	50.8 mm	2 in	Rectangular, Fins	1 in	25.4 mm	Aluminum	TO-218	1 °C/W	Black Anodized
Boyd Laconia, LLC 529901B02100G	41.91 mm	1.65 in	4.5 °C/W	12 W	Bolt On, PC Pin	Board Level, Vertical	50.8 mm	2 in	Rectangular, Fins	1 in	25.4 mm	Aluminum	TO-218	1 °C/W	Black Anodized

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1000	$ 4.04