251-5949-01-0602

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JE150378410 251-5949-01-0602=ZIPSTRIP

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JE150378410 251-5949-01-0602=ZIPSTRIP

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	251-5949-01-0602	251 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	51	51
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.05 in	0.05 in
Pitch - Mating	1.27 mm	1.27 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	0.192 in	0.192 in
Termination Post Length	4.9 mm	4.9 mm
Type	ZIF (ZIP), Zig-Zag	ZIF (ZIP), Zig-Zag

JE150378428 251-5949-02-0602=ZIPSTRIP

Part	Termination	Current Rating (Amps)	Features	Type	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Housing Material	Mounting Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Termination Post Length	Contact Material - Mating	Contact Finish - Post
3M 251-5949-02-0602	Solder	1 A	Closed Frame	ZIF (ZIP), Zig-Zag	Beryllium Copper	30 Áin	0.76 Ám	30 µin	0.76 µm	0.05 in	1.27 mm	51	Polysulfone (PSU), Glass Filled	Through Hole	Gold	2.54 mm	0.1 in	UL94 V-0	-55 °C	125 °C	0.192 in	4.9 mm	Beryllium Copper	Gold
3M 251-5949-01-0602	Solder	1 A	Closed Frame	ZIF (ZIP), Zig-Zag	Beryllium Copper	30 Áin	0.76 Ám	30 µin	0.76 µm	0.05 in	1.27 mm	51	Polysulfone (PSU), Glass Filled	Through Hole	Gold	2.54 mm	0.1 in	UL94 V-0	-55 °C	125 °C	0.192 in	4.9 mm	Beryllium Copper	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

51 (1 x 25, 1 x 26) Pos Zig-Zag, ZIF (ZIP) Socket Gold Through Hole

Technical documentation and resources