42-3572-16

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Aries Electronics

42P DIP NICKEL BORON BERYLLIUM NICKEL 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

42P DIP NICKEL BORON BERYLLIUM NICKEL 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	42-3572-16

Contact Finish - Mating	Nickel Boron
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Beryllium Nickel
Contact Material - Post	Beryllium Nickel
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	42
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish - Post	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Features	Contact Material - Post	Material Flammability Rating	Current Rating (Amps)	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Mounting Type	Housing Material	Contact Finish - Mating
Aries Electronics 42-3572-10	Tin	Solder	5.08 µm	200 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 42-3572-16	Nickel Boron	Solder	1.27 µm	50 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	50 µin	1.27 µm	0.1 in	2.54 mm	Beryllium Nickel	0.11 in	2.78 mm	Closed Frame	Beryllium Nickel	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron
Aries Electronics 42-3572-11	Gold	Solder	0.25 çm	10 çin	7.62 mm	0.3 in	DIP ZIF (ZIP)	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

42 (2 x 21) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole

Technical documentation and resources