SPHWHAHDNH27YZV3DC

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Samsung Semiconductor, Inc.

LED COB D GEN3 WM WHT SQ 3000K

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SPHWHAHDNH27YZV3DC

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Samsung Semiconductor, Inc.

LED COB D GEN3 WM WHT SQ 3000K

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1	$ 4.99
		10	$ 3.53
		250	$ 2.96

Description

General part information

SPHWHAHDNH27 Series

LED Lighting COBs Engines Modules Chip On Board (COB) COB D Gen3 Plus White, Warm Square

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	SPHWHAHDNH27YZV3DC	SPHWHAHDNH27 Series

CCT (K)	3000 K	2700 - 4000 K
Color	White, Warm	White, Warm, Cool, Neutral
Configuration	Square	Square
CRI (Color Rendering Index)	90	90
Current - Max [Max]	1.8 A	1.38 - 2.3 A
Current - Test	900 mA	900 mA
Height [z]	1.5 mm	1.5 - 1.7 mm
Lens Type	Flat	Flat
Light Emitting Surface (LES) [diameter]	14.5 mm	11.5 - 14.5 mm
Lumens/Watt @ Current - Test	137 lm/W	111 - 170 lm/W
Luminous Flux @ Current/Temperature	-	3490 - 5202 lm
Size / Dimension [x]	19 mm	19 mm
Size / Dimension [y]	19 mm	19 mm
Temperature - Test	85 °C	85 °C
Type	Chip On Board (COB)	Chip On Board (COB)
Viewing Angle	115 °	115 °
Voltage - Forward (Vf) (Typ)	33.7 V	33.6 - 35 V

SPHWHAHDNH27 Series

LED COB D GEN2 WARM WHT SQ 2700K

Part	Current - Test	Type	Temperature - Test	Lumens/Watt @ Current - Test	Current - Max [Max]	Configuration	Luminous Flux @ Current/Temperature	CCT (K)	Color	CRI (Color Rendering Index)	Voltage - Forward (Vf) (Typ)	Size / Dimension [y]	Size / Dimension [x]	Viewing Angle	Lens Type	Light Emitting Surface (LES) [diameter]	Height [z]
Samsung Semiconductor, Inc. SPHWHAHDNH27YZW3DB	900 mA	Chip On Board (COB)	85 °C	146 lm/W	1.8 A	Square	4462 lm	2700 K	Warm, White	90	34 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZV2D3	900 mA	Chip On Board (COB)	85 °C	136 lm/W	2.3 A	Square	4152 lm	3000 K	Warm, White	90	34 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZU2D3	900 mA	Chip On Board (COB)	85 °C	140 lm/W	2.3 A	Square	4276 lm	3500 K	Warm, White	90	34 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZR3C2	900 mA	Chip On Board (COB)	85 °C	114 lm/W	1.38 A	Square	3592 lm		Cool, White	90	35 V	19 mm	19 mm	115 °	Flat	11.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZV3D4	900 mA	Chip On Board (COB)	85 °C	143 lm/W	2.3 A	Square	4320 lm	3000 K	Warm, White	90	33.6 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.7 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZV2D2	900 mA	Chip On Board (COB)	85 °C	128 lm/W	2.3 A	Square	3977 lm	3000 K	Warm, White	90	34.6 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZT3DB	900 mA	Chip On Board (COB)	85 °C	169 lm/W	1.8 A	Square	5175 lm	4000 K	Neutral, White	90	34 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZV3DC	900 mA	Chip On Board (COB)	85 °C	137 lm/W	1.8 A	Square		3000 K	Warm, White	90	33.7 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZR3DC	900 mA	Chip On Board (COB)	85 °C	148 lm/W	1.8 A	Square	4493 lm		Cool, White	90	33.7 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNH27YZV3DB	900 mA	Chip On Board (COB)	85 °C	164 lm/W	1.8 A	Square	5014 lm	3000 K	Warm, White	90	34 V	19 mm	19 mm	115 °	Flat	14.5 mm	1.5 mm