QB2010A60ESC
ActiveKyocera AVX
THERMAL CONDUCTOR Q-BRIDGE
Deep-Dive with AI
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QB2010A60ESC
ActiveKyocera AVX
THERMAL CONDUCTOR Q-BRIDGE
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | QB2010A60ESC |
|---|---|
| Material | Aluminum Nitride |
| Outline [x] | 4.95 mm |
| Outline [y] | 2.41 mm |
| Shape | Rectangular |
| Thermal Conductivity | 100 W/m-K, 159 W/m-K |
| Thermal Resistivity | 10 °C/W, 6 °C/W |
| Thickness | 0.0598 in |
| Thickness | 1.52 mm |
| Type | Thermal Bridge Jumper |
| Usage | Heat Transfer |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 100 | $ 6.10 | |
Description
General part information
QB2010 Series
Thermal Pad 4.95mm x 2.41mm Rectangular
Documents
Technical documentation and resources
No documents available