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DEMO45W19VFLYBP7TOBO1 - Infineon Technologies AG-DEMO45W19VFLYBP7TOBO1 Development Kits and Tools IPN70R600P7S Evaluation Board

DEMO45W19VFLYBP7TOBO1

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Infineon Technologies

HIGH EFFICIENCY ADAPTER DESIGN, FEATURING 700V COOLMOS™ P7 IN SOT-223 PACKAGE

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DEMO45W19VFLYBP7TOBO1 - Infineon Technologies AG-DEMO45W19VFLYBP7TOBO1 Development Kits and Tools IPN70R600P7S Evaluation Board

DEMO45W19VFLYBP7TOBO1

Active
Infineon Technologies

HIGH EFFICIENCY ADAPTER DESIGN, FEATURING 700V COOLMOS™ P7 IN SOT-223 PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationDEMO45W19VFLYBP7TOBO1
Board TypeFully Populated
Current - Output2.37 A
Main PurposeAC/DC, Primary and Secondary Side
Outputs and TypeNon-Isolated
Outputs and Type1
Power - Output45 W
Regulator TopologyFlyback
Supplied ContentsBoard(s)
Utilized IC / PartIPN70R600P7S
Voltage - Input [Max]264 VAC
Voltage - Input [Min]90 VAC
Voltage - Output19 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 128.76
DigikeyBulk 1$ 136.62
NewarkEach 1$ 142.10

Description

General part information

DEMO45 Series

This 45W adapter reference board is intended to be a form, fit and function test platform for low cost charger applications to show the state-of-art700V CoolMOS™ P7superjunction (SJ) MOSFET (IPN70R600P7S) inSOT-223 package. The reference adapter board is designed to fit a very small form factor while maintaining high efficiency, low standby power and various modes of protection for a highly reliable system. The board passes EMI (both conducted and radiated), ESD immunity and surge immunity tests, and can be used for production by customers after a final verification with minor changes. The reference board shows how to use the SOT-223 package to meet the thermal requirements in a smaller package size. By transitioning from a FullPAK package to a SOT-223 in adapter designs the overall system cost can be reduced by lowering the amount of manual assembly. There is no more need to mount the MOSFET to a heatsink and the device can be placed in the automated SMD process.