BD9596BMWV-ME2
ActiveRohm Semiconductor
POWER MANAGEMENT IC FOR INTEL® ATOM™ E3800 SERIES
BD9596BMWV-ME2
ActiveRohm Semiconductor
POWER MANAGEMENT IC FOR INTEL® ATOM™ E3800 SERIES
Description
General part information
BD9596BMWV-M Series
BD9596BMWV-M (Jarrell Cove) is a Power Management Integrated Circuit (PMIC) designed specifically for use on Intel® Atom™ E3800 series processors (Bay Trail-I platform) for in-vehicle infotainment (IVI) systems, industrial control systems.
Technical Specifications
Parameters and characteristics for this part
| Specification | BD9596BMWV-ME2 |
|---|---|
| Applications | General Purpose |
| Current - Supply | 22 mA |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 95 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 88-VFQFN Exposed Pad |
| Package Name | UQFN88MV0100 |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 3.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Impedance Characteristics of Bypass Capacitor
ISO 26262: Functional Safety Standard for Modern Road Vehicles
Design Guide and Example of Stencil for Exposed Pad
What Is Thermal Design
Basics of Thermal Resistance and Heat Dissipation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Five Steps for Successful Thermal Design of IC
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Thermal Resistance
BD9596BMWV-M Data Sheet
Solder Joint Rate and Thermal Resistance of Exposed Pad
Enhancing Efficiency By Reducing Converter Stages & RON In Power Management ICs
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
UQFN88MV0100 Package Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Factory Information
PCB Layout Thermal Design Guide
How to Use the Two-Resistor Model
Judgment Criteria of Thermal Evaluation