Specification	24-7040-8801

Ag Composition	3.5 %
Composition Elements	Sn, Ag
Composition Formula	Sn96.5Ag3.5
Diameter	0.031 in
Form	Spool
Form Weight	1 lb
Melting Point	430 °F
Process	Lead Free
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	20 AWG, 22 SWG

24-7040 Series

Part	Type	Process	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Wire Gauge	Diameter	Flux Type	Form Weight	Form	Composition Formula	Composition Elements	Ag Composition	Sn Composition	Melting Point
Kester Solder 24-7040-0027	Wire Solder	Lead Free	50 °F	104 °F	20 AWG 22 SWG	0.031 in	Rosin Activated (RA)	1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-8846	Wire Solder	Lead Free	50 °F	104 °F	18 AWG 19 SWG	0.04 in		1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-0061	Wire Solder	Lead Free	50 °F	104 °F	14 AWG 16 SWG	0.062 in	Rosin Activated (RA)	1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-8803	Wire Solder	Lead Free	50 °F	104 °F	14 AWG 16 SWG	0.062 in		1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-8801	Wire Solder	Lead Free	50 °F	104 °F	20 AWG 22 SWG	0.031 in		1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-7601	Wire Solder	Lead Free	50 °F	104 °F	20 AWG 22 SWG	0.031 in		1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F
Kester Solder 24-7040-8834	Wire Solder	Lead Free	50 °F	104 °F	24 AWG 25 SWG	0.02 in		1 lb	Spool	Sn96.5Ag3.5	Ag Sn	3.5 %	96.5 %	430 °F

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