681-4

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Microchip Technology

CENTER TAP ND EPOXY MODULE ROHS COMPLIANT: YES

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681-4

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Microchip Technology

CENTER TAP ND EPOXY MODULE ROHS COMPLIANT: YES

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Description Specifications Series Pricing CAD Documents

Description

General part information

681_e3_689_e3series Series

This series of high-current center tap and doubler assemblies are constructed with hermetically sealed rectifiers built with the same design and construction techniques used in military applications for the upmost in reliability, making them ideal for applications where failure cannot be tolerated. These industry-recognized 15 Amp rated rectifier modules with working peak reverse voltage ratings of 100 to 600 V per leg use diodes that are hermetically sealed with voidless-glass encapsulation using internal "Category 1" metallurgical bonds, with both standard and fast recovery times. Microchip also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages.

Technical Specifications

Parameters and characteristics for this part

Specification	681-4

Current - Average Rectified (Io) (per Diode)	15 A
Current - Reverse Leakage	10 µA
Diode Configuration	Series Connection
Diode Pair Count	1 pair
Mounting Type	Chassis Mount
Operating Temperature - Junction (Max)	150 °C
Operating Temperature - Junction (Min)	-65 °C
Package / Case	ND, Module
Package Name	ND
Speed	Standard Recovery
Speed - Fast Recovery (Minimum)	200 mA, 500 ns
Speed - Recovery Current	200 mA, 200 mA
Speed - Recovery Time	500 ns
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	400 V
Voltage - Forward (Vf) (Max)	1.2 V

681_e3_689_e3series Series

Part	Package / Case	Voltage - Forward (Vf) (Max)	Package Name	Speed - Fast Recovery (Minimum)	Speed	Speed - Recovery Current	Speed - Recovery Time	Current - Reverse Leakage	Technology	Operating Temperature - Junction (Max)	Operating Temperature - Junction (Min)	Mounting Type	Current - Average Rectified (Io) (per Diode)	Diode Pair Count	Diode Configuration	Voltage - DC Reverse (Vr) (Max)	Speed - Fast Recovery (Maximum)	Reverse Recovery Time (trr)
Microchip Technology 681-4	Module ND	1.2 V	ND	200 mA 500 ns	Standard Recovery	200 mA 200 mA	500 ns	10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	400 V
Microchip Technology 681-2	Module ND	1.2 V	ND	200 mA 500 ns	Standard Recovery	200 mA 200 mA	500 ns	10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	200 V
Microchip Technology 689-3N	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Common Anode	300 V	500 ns	500 ns
Microchip Technology 689-6	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	600 V	500 ns	500 ns
Microchip Technology 689-3	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	300 V	500 ns	500 ns
Microchip Technology 689-5	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	500 V	500 ns	500 ns
Microchip Technology 689-3D	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	300 V	500 ns	500 ns
Microchip Technology 689-2	Module ND	1.2 V	ND	200 mA				10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	200 V	500 ns	500 ns
Microchip Technology 681-1	Module ND	1.2 V	ND	200 mA 500 ns	Standard Recovery	200 mA 200 mA	500 ns	10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Series Connection	100 V
Microchip Technology 681-2P	Module ND	1.2 V	ND	200 mA 500 ns	Standard Recovery	200 mA 200 mA	500 ns	10 µA	Standard	150 °C	-65 °C	Chassis Mount	15 A	1 pair	Common Cathode	200 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

681-4 | Datasheet

MicroNote070_Final.pdf

MicroNote 020: Plating and Solder Dipping

MicroNote 30: Metallurgical Bond Evaluation Methods for Diodes

681_e3_689_e3series_Fast Recovery Rectifier

MicroNote 010: How to Quickly Obtain Spice Data

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