RB421DT146
ActiveRohm Semiconductor
SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 40 V, 100 MA, 550 MV, 1 A, 125 °C
RB421DT146
ActiveRohm Semiconductor
SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 40 V, 100 MA, 550 MV, 1 A, 125 °C
Description
General part information
RB421 Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB421DT146 |
|---|---|
| Capacitance | 6 pF |
| Current - Average Rectified (Io) | 100 mA |
| Current - Reverse Leakage | 30 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 125 °C |
| Package / Case | TO-236-3, SOT-23-3, SC-59 |
| Package Name | SMD3 |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 550 mV, 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
RB421D Data Sheet
Power Loss and Thermal Design of Diodes
What is a Thermal Model? (Diode)
Importance of Probe Calibration When Measuring Power: Deskew
Reliability Test Result
About Flammability of Materials
Two-Resistor Model for Thermal Simulation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Select Reverse Current Protection Diodes for LDO Regulators
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Measurement Method and Usage of Thermal Resistance RthJC
How to Create Symbols for PSpice Models
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
What Is Thermal Design
How to Use LTspice® Models: Tips for Improving Convergence
ESD Data
Impedance Characteristics of Bypass Capacitor
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Diode Selection Method for Asynchronous Converter
Certificate of not containing SVHC under REACH Regulation
Taping Information
Notes for Temperature Measurement Using Thermocouples
Part Explanation
Constitution Materials List
Judgment Criteria of Thermal Evaluation
Anti-Whisker formation - Diodes
Explanation for Marking
How to Select Rectifier Diodes
How to Use LTspice® Models
Inner Structure
Basics of Thermal Resistance and Heat Dissipation
About Export Regulations
Moisture Sensitivity Level - Diodes
Compliance of the RoHS directive
Package Dimensions
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Diode Types and Applications
List of Diode Package Thermal Resistance
Condition of Soldering / Land Pattern Reference
Precautions When Measuring the Rear of the Package with a Thermocouple
Absolute Maximum Rating and Electrical Characteristics of Diodes
PCB Layout Thermal Design Guide
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Notes for Calculating Power Consumption:Static Operation
