
DSPIC33EP256GP502T-I/SS
ActiveMCU 16-BIT DSPIC RISC 256KB FLASH 3.3V 28-PIN SSOP T/R
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DSPIC33EP256GP502T-I/SS
ActiveMCU 16-BIT DSPIC RISC 256KB FLASH 3.3V 28-PIN SSOP T/R
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Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | DSPIC33EP256GP502T-I/SS | dsPIC33EP256GP502 Series |
---|---|---|
- | - | |
Connectivity | IrDA, UART/USART, I2C, CANbus, SPI, LINbus | IrDA, UART/USART, I2C, CANbus, SPI, LINbus |
Core Processor | dsPIC | dsPIC |
Core Size | 16-Bit | 16-Bit |
Data Converters | 6 channels | 6 channels |
Data Converters [custom] | 12 b, 10 b | 10 - 12 b |
Grade | - | Automotive |
Mounting Type | Surface Mount | Through Hole, Surface Mount |
Number of I/O | 21 I/O | 21 I/O |
Operating Temperature [Max] | 85 °C | 85 - 125 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Oscillator Type | Internal | Internal |
Package / Case | 28-SSOP | 28-DIP, 28-VQFN Exposed Pad, 28-SSOP |
Package / Case | - | 0.3 in |
Package / Case | - | 7.62 mm |
Package / Case [custom] | 0.209 in | 0.209 in |
Package / Case [custom] | 5.3 mm | 5.3 mm |
Peripherals | Brown-out Detect/Reset, DMA, POR, WDT, PWM | Brown-out Detect/Reset, DMA, POR, WDT, PWM |
Program Memory Size | 256 KB | 256 KB |
Program Memory Type | FLASH | FLASH |
Qualification | - | AEC-Q100 |
RAM Size | 16K x 16 | 16K x 16 |
Speed | 70 MIPs | 60 - 70 MIPs |
Supplier Device Package | 28-SSOP | 28-SPDIP, 28-QFN-S (6x6), 28-SSOP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
Digikey | Tape & Reel (TR) | 2100 | $ 3.75 | |
Microchip Direct | T/R | 1 | $ 4.52 | |
25 | $ 4.13 | |||
100 | $ 3.75 | |||
1000 | $ 3.46 | |||
5000 | $ 3.27 |
dsPIC33EP256GP502 Series
16-Bit DSC, Hi-Speed PWM, Op Amps, Adv Analog
Part | RAM Size | Program Memory Type | Oscillator Type | Core Processor | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Speed | Connectivity | Qualification | Supplier Device Package | Package / Case | Package / Case | Package / Case | Grade | Number of I/O | Peripherals | Core Size | Data Converters | Data Converters [custom] | Program Memory Size | Package / Case [custom] | Package / Case [custom] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology DSPIC33EP256GP502-E/SP | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 125 °C | Through Hole | 60 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | AEC-Q100 | 28-SPDIP | 0.3 in | 28-DIP | 7.62 mm | Automotive | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | ||
Microchip Technology DSPIC33EP256GP502-I/SO | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502T-I/MM | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 85 °C | Surface Mount | 70 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 28-QFN-S (6x6) | 28-VQFN Exposed Pad | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | ||||||
Microchip Technology DSPIC33EP256GP502-E/MM | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 125 °C | Surface Mount | 60 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | AEC-Q100 | 28-QFN-S (6x6) | 28-VQFN Exposed Pad | Automotive | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | ||||
Microchip Technology DSPIC33EP256GP502-E/MM | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502T-I/SS | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 85 °C | Surface Mount | 70 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 28-SSOP | 28-SSOP | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | 0.209 in | 5.3 mm | ||||
Microchip Technology DSPIC33EP256GP502-I/SP | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 85 °C | Through Hole | 70 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 28-SPDIP | 0.3 in | 28-DIP | 7.62 mm | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | ||||
Microchip Technology DSPIC33EP256GP502-I/SP | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502T-I/SS | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502-I/SS | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502-I/MM | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502-I/SO | |||||||||||||||||||||||
Microchip Technology DSPIC33EP256GP502-I/MM | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 85 °C | Surface Mount | 70 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 28-QFN-S (6x6) | 28-VQFN Exposed Pad | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | ||||||
Microchip Technology DSPIC33EP256GP502-I/SS | 16K x 16 | FLASH | Internal | dsPIC | -40 °C | 85 °C | Surface Mount | 70 MIPs | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 28-SSOP | 28-SSOP | 21 I/O | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16-Bit | 6 channels | 10 b, 12 b | 256 KB | 0.209 in | 5.3 mm | ||||
Microchip Technology DSPIC33EP256GP502-I/MM |
Description
General part information
dsPIC33EP256GP502 Series
Microchip’s dsPIC33E general purpose DSC family features the highest speed 70 MIPS core with excellent performance and code density. It offers superior ADC performance, enhanced CAN communication, CTMU, Op Amps and Peripheral Trigger Generator (PTG) for high-end general purpose applications. These devices are available in various packages and with an extended (125°C) temp option.
Documents
Technical documentation and resources