RF1601T2DNZC9
ActiveRohm Semiconductor
RECTIFIER, 200V, 16A, TO-220FN ROHS COMPLIANT: YES
RF1601T2DNZC9
ActiveRohm Semiconductor
RECTIFIER, 200V, 16A, TO-220FN ROHS COMPLIANT: YES
Description
General part information
RF1601 Series
RF1601T2DNZ is Super Fast Recovery Diode for general rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RF1601T2DNZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 16 A |
| Current - Reverse Leakage | 10 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Reverse Recovery Time (trr) | 30 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 200 V |
| Voltage - Forward (Vf) (Max) | 930 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Measurement Method and Usage of Thermal Resistance RthJC
Taping Information
Two-Resistor Model for Thermal Simulation
Absolute Maximum Rating and Electrical Characteristics of Diodes
Diode Types and Applications
About Export Regulations
Compliance of the RoHS directive
Inner Structure
Reliability Test Result
Explanation for Marking
What is a Thermal Model? (Diode)
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use LTspice® Models: Tips for Improving Convergence
Method for Monitoring Switching Waveform
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Basics of Thermal Resistance and Heat Dissipation
Impedance Characteristics of Bypass Capacitor
Power Loss and Thermal Design of Diodes
PCB Layout Thermal Design Guide
RF1601T2DNZ ESD Data
Condition of Soldering / Land Pattern Reference
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Importance of Probe Calibration When Measuring Power: Deskew
How to Select Rectifier Diodes
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Certificate of not containing SVHC under REACH Regulation
List of Diode Package Thermal Resistance
Judgment Criteria of Thermal Evaluation
About Flammability of Materials
Notes for Temperature Measurement Using Thermocouples
How to Use LTspice® Models
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Part Explanation
What Is Thermal Design
Anti-Whisker formation - Diodes
Package Dimensions
Precautions When Measuring the Rear of the Package with a Thermocouple
Moisture Sensitivity Level - Diodes
Notes for Calculating Power Consumption:Static Operation