W66AQ6NBQAGJ

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Winbond Electronics

IC DRAM 1GBIT LVSTL 200TFBGA

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Winbond Electronics

IC DRAM 1GBIT LVSTL 200TFBGA

Technical Specifications

Parameters and characteristics commom to parts in this series

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	144	$ 3.44

IC DRAM 1GBIT LVSTL 100VFBGA

Part	Memory Organization	Access Time	Clock Frequency	Memory Type	Mounting Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case	Memory Interface	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Technology	Supplier Device Package [x]	Supplier Device Package [y]	Supplier Device Package	Write Cycle Time - Word, Page
Winbond Electronics W66AQ6NBHAGJ TR	64 M	3.6 ns	1.867 GHz	Volatile	Surface Mount	1.06 V, 1.7 V	1.17 V, 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBQAGJ	64 M	3.6 ns	1.867 GHz	Volatile	Surface Mount	1.06 V, 1.7 V	1.17 V, 1.95 V	200-TFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	14.5	200-TFBGA	18 ns
Winbond Electronics W66AQ6NBHAHJ	64 M	3.6 ns	2.133 GHz	Volatile	Surface Mount	1.06 V, 1.7 V	1.17 V, 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBHAFJ TR	64 M	3.6 ns	1.6 GHz	Volatile	Surface Mount	1.06 V, 1.7 V	1.17 V, 1.95 V	100-VFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	7.5	100-VFBGA	18 ns
Winbond Electronics W66AQ6NBQAHJ	64 M	3.6 ns	2.133 GHz	Volatile	Surface Mount	1.06 V, 1.7 V	1.17 V, 1.95 V	200-TFBGA	LVSTL_06	DRAM	105 °C	-40 °C	1 Mbit	SDRAM - Mobile LPDDR4X	10	14.5	200-TFBGA	18 ns

General part information

SDRAM - Mobile LPDDR4X Memory IC 1Gbit LVSTL_06 1.867 GHz 3.6 ns 200-TFBGA (10x14.5)

Technical documentation and resources

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