Zenode.ai Logo
Beta
K
M48T37V-10MH1F - RTC IC, YY-MM-DD-dd, HH:MM:SS, 24Hr, Parallel, 3 V to 3.6 V, 44 Pins, SOIC

M48T37V-10MH1F

Active
STMicroelectronics

REAL TIME CLOCK PARALLEL 32KBYTE CLOCK/CALENDAR/NV TIMEKEEPING RAM/WATCHDOG TIMER/BATTERY BACKUP/ALARM 44-PIN SOH T/R

Deep-Dive with AI

Search across all available documentation for this part.

M48T37V-10MH1F - RTC IC, YY-MM-DD-dd, HH:MM:SS, 24Hr, Parallel, 3 V to 3.6 V, 44 Pins, SOIC

M48T37V-10MH1F

Active
STMicroelectronics

REAL TIME CLOCK PARALLEL 32KBYTE CLOCK/CALENDAR/NV TIMEKEEPING RAM/WATCHDOG TIMER/BATTERY BACKUP/ALARM 44-PIN SOH T/R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationM48T37V-10MH1F
Current - Timekeeping (Max)2 mA
FeaturesWatchdog Timer, Alarm, Leap Year
InterfaceParallel
Mounting TypeSurface Mount
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case0.337 in, 8.56 mm
Package / Case44-BSOP
Supplier Device Package44-SOH
Time FormatHH:MM:SS (24 hr)
TypeClock/Calendar
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 22.76
10$ 20.99
25$ 20.05
100$ 17.93
250$ 17.10
Digi-Reel® 1$ 22.76
10$ 20.99
25$ 20.05
100$ 17.93
250$ 17.10
Tape & Reel (TR) 936$ 16.28
NewarkEach (Supplied on Cut Tape) 1$ 23.18
10$ 18.59
25$ 17.45
50$ 16.82
100$ 16.19
250$ 15.58
500$ 15.35
1872$ 14.56

Description

General part information

M48T37V Series

The M48T37Y/V TIMEKEEPER®RAM is a 32 Kb x 8 non-volatile static RAM and real-time clock. The monolithic chip is available in a special package which provides a highly integrated battery-backed memory and real-time clock solution.

The 44-lead, 330 mil SOIC package provides sockets with gold-plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design allows the SNAPHAT®battery/crystal package to be mounted on top of the SOIC package after the completion of the surface mount process.

Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to prevent reverse insertion.