
RB228T150NZC9
ActiveRohm Semiconductor
SUPER LOW IR, 150V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE

RB228T150NZC9
ActiveRohm Semiconductor
SUPER LOW IR, 150V, 30A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RB228T150NZ Series
RB228T150NZ is super low IRschottky barrier diode for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB228T150NZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 30 A |
| Current - Reverse Leakage | 25 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 150 V |
| Voltage - Forward (Vf) (Max) | 880 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
About Export Regulations
RB228T150NZ Data Sheet
Explanation for Marking
Notes for Temperature Measurement Using Thermocouples
Certificate of not containing SVHC under REACH Regulation
Reliability Test Result
Two-Resistor Model for Thermal Simulation
What Is Thermal Design
Basics of Thermal Resistance and Heat Dissipation
Anti-Whisker formation - Diodes
RB228T150NZ ESD Data
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
List of Diode Package Thermal Resistance
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Importance of Probe Calibration When Measuring Power: Deskew
PCB Layout Thermal Design Guide
How to Select Reverse Current Protection Diodes for LDO Regulators
Absolute Maximum Rating and Electrical Characteristics of Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Inner Structure
Package Dimensions
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Method for Monitoring Switching Waveform
Measurement Method and Usage of Thermal Resistance RthJC
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Use LTspice® Models
How to Select Rectifier Diodes
How to Use LTspice® Models: Tips for Improving Convergence
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Judgment Criteria of Thermal Evaluation
Part Explanation
Moisture Sensitivity Level - Diodes
Power Loss and Thermal Design of Diodes
Condition of Soldering / Land Pattern Reference
What is a Thermal Model? (Diode)
About Flammability of Materials
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Calculating Power Consumption:Static Operation
Compliance of the RoHS directive
Diode Types and Applications
Impedance Characteristics of Bypass Capacitor
Diode Selection Method for Asynchronous Converter
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Create Symbols for PSpice Models
Taping Information