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100-028-000

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3M

CONN IC DIP SOCKET 28POS GOLD

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100-028-000

Active
3M

CONN IC DIP SOCKET 28POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification100-028-000100-028 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating0.203 Ám0.203 Ám
Contact Finish Thickness - Mating8 Áin8 Áin
Contact Finish Thickness - PostFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)1 A1 A
FeaturesOpen FrameSeal Tape, Closed Frame, Open Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)2828
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-65 ░C-65 ░C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.2 mm3.2 mm
Termination Post Length0.126 in0.126 in
TypeDIPDIP
Type0.6 in0.6 in
Type15.24 mm15.24 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-028 Series

CONN IC DIP SOCKET 28POS GOLD

PartHousing MaterialTypeTypeTypeFeaturesTerminationCurrent Rating (Amps)Contact Finish - MatingMaterial Flammability RatingContact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - PostPitch - PostContact Material - Post [custom]Contact Finish Thickness - PostMounting TypeOperating Temperature [Max]Operating Temperature [Min]Termination Post LengthTermination Post LengthPitch - MatingPitch - MatingContact Material - MatingNumber of Positions or Pins (Grid)
Polyphenylene Sulfide (PPS), Glass Filled
DIP
0.6 in
15.24 mm
Closed Frame, Seal Tape
Solder
1 A
Gold
UL94 V-0
Gold
0.203 Ám
8 Áin
2.54 mm
0.1 in
Brass
Flash
Through Hole
125 °C
-65 ░C
3.2 mm
0.126 in
0.1 in
2.54 mm
Beryllium Copper
28
Polyphenylene Sulfide (PPS), Glass Filled
DIP
0.6 in
15.24 mm
Open Frame
Solder
1 A
Gold
UL94 V-0
Gold
0.203 Ám
8 Áin
2.54 mm
0.1 in
Brass
Flash
Through Hole
125 °C
-65 ░C
3.2 mm
0.126 in
0.1 in
2.54 mm
Beryllium Copper
28

Description

General part information

100-028 Series

28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available