CONN IC DIP SOCKET 28POS GOLD
| Part | Housing Material | Type | Type | Type | Features | Termination | Current Rating (Amps) | Contact Finish - Mating | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Contact Finish Thickness - Post | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Polyphenylene Sulfide (PPS), Glass Filled | DIP | 0.6 in | 15.24 mm | Closed Frame, Seal Tape | Solder | 1 A | Gold | UL94 V-0 | Gold | 0.203 Ám | 8 Áin | 2.54 mm | 0.1 in | Brass | Flash | Through Hole | 125 °C | -65 ░C | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | Beryllium Copper | 28 | |
Polyphenylene Sulfide (PPS), Glass Filled | DIP | 0.6 in | 15.24 mm | Open Frame | Solder | 1 A | Gold | UL94 V-0 | Gold | 0.203 Ám | 8 Áin | 2.54 mm | 0.1 in | Brass | Flash | Through Hole | 125 °C | -65 ░C | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | Beryllium Copper | 28 |