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STM32F733VEY6TR - 100-WLCSP

STM32F733VEY6TR

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STMicroelectronics

HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 512 KBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM

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STM32F733VEY6TR - 100-WLCSP

STM32F733VEY6TR

Active
STMicroelectronics

HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 512 KBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSTM32F733VEY6TR
ConnectivityIrDA, QSPI, EBI/EMI, CANbus, I2C, USB, LINbus, SAI, UART/USART, SPI, MMC/SD
Core ProcessorARM® Cortex®-M7
Core Size32-Bit Single-Core
Data ConvertersA/D 24x12b, D/A 2x12b
Mounting TypeSurface Mount
Number of I/O79
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case100-UFBGA, WLCSP
PeripheralsBrown-out Detect/Reset, DMA, POR, WDT, PWM, I2S
Program Memory Size512 KB
Program Memory TypeFLASH
RAM Size256 K
Speed216 MHz
Supplier Device Package100-WLCSP (4.2x4.7)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 5000$ 8.14

Description

General part information

STM32F733ZE Series

The STM32F732xx and STM32F733xx devices are based on the high-performance Arm®Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a single floating point unit (SFPU) precision which supports Arm®single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.

The STM32F732xx and STM32F733xx devices incorporate high-speed embedded memories with a Flash memory up to 512 Kbytes, 256 Kbytes of SRAM (including 64 Kbytes of data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.

All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, thirteen general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.

Documents

Technical documentation and resources