Specification	TEM-120-02-04.0-H-D-LC-K

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	3 µin
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	2.9 A
Fastening Type	Push-Pull
Features	Pick and Place, Board Lock
Insulation Color	Black
Insulation Height	0.26 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mated Stacking Height	7 mm
Mounting Type	Surface Mount
Number of Positions	40
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.031 in
Row Spacing - Mating	0.063 in
Shrouding	Shrouded - 4 Wall
Style	Board
Termination	Solder

TEM-120 Series

Part	Contact Type	Mounting Type	Number of Positions Loaded	Contact Material	Contact Finish - Post	Current Rating (Per Contact)	Row Spacing - Mating	Pitch - Mating	Style	Contact Finish - Mating	Number of Rows	Shrouding	Fastening Type	Insulation Color	Contact Shape	Operating Temperature (Max)	Operating Temperature (Min)	Features	Insulation Height	Connector Type	Insulation Material	Contact Finish Thickness - Mating	Termination	Number of Positions	Contact Finish Thickness - Post	Mated Stacking Height
Samtec Inc. TEM-115-02-03.0-H-D-A	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Board Guide	0.22 in	Header	Liquid Crystal Polymer (LCP)	30 µin	Solder	30	3 µin	6 mm
Samtec Inc. TEM-115-02-03.0-H-D-A-K	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Board Guide Pick and Place	0.22 in	Header	Liquid Crystal Polymer (LCP)	30 µin	Solder	30	3 µin	6 mm
Samtec Inc. TEM-115-02-03.0-G-D-L1-K	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Latch Lock	Black	Square	125 °C	-55 °C	Pick and Place	0.22 in	Header	Liquid Crystal Polymer (LCP)	10 µin	Solder	30	3 µin	6 mm
Samtec Inc. TEM-115-02-03.0-FG-D-WT	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Solder Retention	0.22 in	Header	Liquid Crystal Polymer (LCP)	3 µin	Solder	30	3 µin	6 mm
Samtec Inc. TEM-115-02-04.0-H-D-WT-K	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Pick and Place Solder Retention	0.26 in	Header	Liquid Crystal Polymer (LCP)	30 µin	Solder	30	3 µin	7 mm
Samtec Inc. TEM-115-02-07.0-H-D-WT	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Solder Retention	0.378 in	Header	Liquid Crystal Polymer (LCP)	30 µin	Solder	30	3 µin	10 mm
Samtec Inc. TEM-115-02-03.0-FG-D	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C		0.22 in	Header	Liquid Crystal Polymer (LCP)	3 µin	Solder	30	3 µin	6 mm
Samtec Inc. TEM-115-02-07.0-H-D-LC-K	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Board Lock Pick and Place	0.378 in	Header	Liquid Crystal Polymer (LCP)	30 µin	Solder	30	3 µin	10 mm
Samtec Inc. TEM-115-02-04.0-G-D-LC-K	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Board Lock Pick and Place	0.26 in	Header	Liquid Crystal Polymer (LCP)	10 µin	Solder	30	3 µin	7 mm
Samtec Inc. TEM-115-02-07.0-G-D-WT	Male Pin	Surface Mount	All	Phosphor Bronze	Gold	2.9 A	0.063 in	0.031 in	Board	Gold	2	Shrouded - 4 Wall	Push-Pull	Black	Square	125 °C	-55 °C	Solder Retention	0.378 in	Header	Liquid Crystal Polymer (LCP)	10 µin	Solder	30	3 µin	10 mm

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