TEM-115-02-07.0-H-D-WT

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Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS MICRO TIGER EYE HEADER STRIP, 0.80 MM PITCH

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TEM-115-02-07.0-H-D-WT

Active

Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS MICRO TIGER EYE HEADER STRIP, 0.80 MM PITCH

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TEM-115-02-07.0-H-D-WT

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Material	Liquid Crystal Polymer (LCP)
Mated Stacking Heights	10 mm
Mounting Type	Surface Mount
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.031 in
Pitch - Mating	0.8 mm
Row Spacing - Mating [x]	1.6 mm
Row Spacing - Mating [x]	0.063 in
Shrouding	Shrouded - 4 Wall
Termination	Solder

TEM-115 Series

Board to Board & Mezzanine Connectors Micro Tiger Eye Header Strip, 0.80 mm pitch

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Fastening Type	Connector Type	Number of Rows	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Material	Number of Positions	Contact Finish - Mating	Insulation Color	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Shape	Mated Stacking Heights	Contact Type	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Height	Insulation Height	Shrouding	Number of Positions Loaded	Current Rating (Amps)	Insulation Material
Samtec Inc. TEM-115-02-03.0-H-D-A	30 Áin	0.76 Ám	Board Guide	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	6 mm	Male Pin	Solder	-55 °C	125 °C	5.6 mm	0.22 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-03.0-H-D-A-K	30 Áin	0.76 Ám	Board Guide Pick and Place	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	6 mm	Male Pin	Solder	-55 °C	125 °C	5.6 mm	0.22 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-03.0-G-D-L1-K	10 çin	0.25 çm	Pick and Place	1.6 mm	0.063 in	Latch Lock	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	6 mm	Male Pin	Solder	-55 °C	125 °C	5.6 mm	0.22 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-03.0-FG-D-WT	3 µin	0.076 µm	Solder Retention	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	6 mm	Male Pin	Solder	-55 °C	125 °C	5.6 mm	0.22 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-04.0-H-D-WT-K	30 Áin	0.76 Ám	Pick and Place Solder Retention	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	7 mm	Male Pin	Solder	-55 °C	125 °C	6.6 mm	0.26 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-07.0-H-D-WT	30 Áin	0.76 Ám	Solder Retention	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	10 mm	Male Pin	Solder	-55 °C	125 °C			Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-03.0-FG-D	3 µin	0.076 µm		1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	6 mm	Male Pin	Solder	-55 °C	125 °C	5.6 mm	0.22 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-07.0-H-D-LC-K	30 Áin	0.76 Ám	Board Lock Pick and Place	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	10 mm	Male Pin	Solder	-55 °C	125 °C			Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-115-02-04.0-G-D-LC-K	10 çin	0.25 çm	Board Lock Pick and Place	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	30	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	7 mm	Male Pin	Solder	-55 °C	125 °C	6.6 mm	0.26 in	Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)
Samtec Inc. TEM-140-02-07.0-H-D-A-TR	30 Áin	0.76 Ám	Board Guide	1.6 mm	0.063 in	Push-Pull	Header	2	0.031 in	0.8 mm	Gold	Phosphor Bronze	80	Gold	Black	Surface Mount	3 µin	0.076 µm	Square	10 mm	Male Pin	Solder	-55 °C	125 °C			Shrouded - 4 Wall	All	2.9 A	Liquid Crystal Polymer (LCP)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	70	$ 6.15
Sager	N/A	70	$ 5.83
		140	$ 4.85
		490	$ 4.53
		980	$ 3.88
		3080	$ 3.23
		8400	$ 2.98
		18130	$ 2.76

Description

General part information

TEM-115 Series

Board to Board & Mezzanine Connectors Micro Tiger Eye Header Strip, 0.80 mm pitch

Documents

Technical documentation and resources

Datasheet

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