TST-107-01-G-D-13

Active

Samtec Inc.

CONN SHROUDED HEADER HDR 14 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Deep-Dive with AI

Search across all available documentation for this part.

TST-107-01-G-D-13

Active

Samtec Inc.

CONN SHROUDED HEADER HDR 14 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TST-107-01-G-D-13

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	6.35 mm
Contact Length - Mating	0.25 in
Contact Length - Post	2.92 mm
Contact Length - Post	0.115 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Features	Keying Slot
Insulation Color	Black
Insulation Height [custom]	0.35 in
Insulation Height [custom]	8.89 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	14
Number of Positions Loaded	13
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	0.48 in
Overall Contact Length	12.19 mm
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Shrouded - 4 Wall
Style	Board to Cable/Wire
Termination	Solder

TST-107 Series

Part	Number of Positions	Overall Contact Length	Overall Contact Length	Connector Type	Insulation Height [custom]	Insulation Height [custom]	Style	Contact Length - Post	Contact Length - Post	Contact Finish - Post	Insulation Material	Mounting Type	Number of Rows	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Shape	Termination	Pitch - Mating	Pitch - Mating	Features	Shrouding	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material	Contact Length - Mating	Contact Length - Mating	Insulation Color	Material Flammability Rating	Number of Positions Loaded	Fastening Type	Contact Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height	Contact Finish Thickness - Mating	Number of Positions Loaded	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. TST-107-01-G-D-13	14	0.48 in	12.19 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire	2.92 mm	0.115 in	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0	13	Push-Pull	Male Pin	3 µin	0.076 µm	Gold	10 çin	0.25 çm
Samtec Inc. TST-107-04-L-D-RA-06	14			Header			Board to Cable/Wire	3.3 mm	0.13 in	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole Right Angle	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0	13	Push-Pull	Male Pin			Gold	10 çin	0.25 çm	0.365 in	9.27 mm
Samtec Inc. TST-107-01-G-D-03	14	0.48 in	12.19 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire	2.92 mm	0.115 in	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0	13	Push-Pull	Male Pin	3 µin	0.076 µm	Gold	10 çin	0.25 çm
Samtec Inc. TST-107-04-F-D-RA	14			Header			Board to Cable/Wire	3.3 mm	0.13 in	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole Right Angle	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0		Push-Pull	Male Pin			Gold			0.365 in	9.27 mm	Flash	All
Samtec Inc. TST-107-01-S-S	7	0.48 in	12.19 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire	2.92 mm	0.115 in	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	1			Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0		Push-Pull	Male Pin			Gold	30 Áin	0.76 Ám				All
Samtec Inc. TST-107-01-L-D-10	14	0.48 in	12.19 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire	2.92 mm	0.115 in	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0	13	Push-Pull	Male Pin			Gold	10 çin	0.25 çm
Samtec Inc. TST-107-01-G-D-01	14	0.48 in	12.19 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire	2.92 mm	0.115 in	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0	13	Push-Pull	Male Pin	3 µin	0.076 µm	Gold	10 çin	0.25 çm
Samtec Inc. TST-107-02-G-D	14	0.53 in	13.46 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire			Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0		Push-Pull	Male Pin	3 µin	0.076 µm	Gold	10 çin	0.25 çm				All	0.165 in	4.19 mm
Samtec Inc. TST-107-04-S-D-LA
Samtec Inc. TST-107-02-T-D	14	0.53 in	13.46 mm	Header	0.35 in	8.89 mm	Board to Cable/Wire			Tin	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2	2.54 mm	0.1 in	Square	Solder	0.1 in	2.54 mm	Keying Slot	Shrouded - 4 Wall	-55 °C	105 ░C	Phosphor Bronze	6.35 mm	0.25 in	Black	UL94 V-0		Push-Pull	Male Pin									All	0.165 in	4.19 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 3.60
		50	$ 2.93
		100	$ 2.49
Digikey	Bulk	1	$ 3.60

Description

General part information

TST-107 Series

Connector Header Through Hole 14 position 0.100" (2.54mm)

Documents

Technical documentation and resources

No documents available