Specification	FOLC-150-L2-S-Q-LC-P

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Material	Beryllium Copper
Contact Shape	Square
Contact Type	Female Socket
Current Rating (Per Contact)	2.6 A
Fastening Type	Push-Pull
Features	Pick and Place, Board Lock
Insulation Color	Black
Insulation Height	0.178 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	200
Number of Positions Loaded	All
Number of Rows	4
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Row Spacing - Mating	0.05 in
Style	Board
Termination	Solder

FOLC-150 Series

Part	Row Spacing - Mating	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Number of Positions Loaded	Fastening Type	Contact Finish - Post	Insulation Height	Insulation Color	Mounting Type	Material Flammability Rating	Style	Number of Positions	Current Rating (Per Contact)	Contact Finish - Mating	Number of Rows	Pitch - Mating	Contact Type	Contact Finish Thickness - Mating	Insulation Material	Contact Material	Contact Shape	Features	Contact Length - Post
Samtec Inc. FOLC-150-02-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-150-02-S-Q-LC-P	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock Pick and Place
Samtec Inc. FOLC-150-L1-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.075 in
Samtec Inc. FOLC-150-L4-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-M1-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.075 in
Samtec Inc. FOLC-150-M1-L-Q-LC	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock	0.075 in
Samtec Inc. FOLC-150-04-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-L4-S-Q-LC	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock	0.12 in
Samtec Inc. FOLC-150-M2-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-02-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

No documents available