FOLC-150 Series

Catalog

CONN SOCKET STRIP SKT 200 POS 0.64MM SOLDER ST SMD TUBE

Part	Row Spacing - Mating	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Number of Positions Loaded	Fastening Type	Contact Finish - Post	Insulation Height	Insulation Color	Mounting Type	Material Flammability Rating	Style	Number of Positions	Current Rating (Per Contact)	Contact Finish - Mating	Number of Rows	Pitch - Mating	Contact Type	Contact Finish Thickness - Mating	Insulation Material	Contact Material	Contact Shape	Features	Contact Length - Post
Samtec Inc. FOLC-150-02-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square
Samtec Inc. FOLC-150-02-S-Q-LC-P	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock Pick and Place
Samtec Inc. FOLC-150-L1-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.075 in
Samtec Inc. FOLC-150-L4-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-M1-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.075 in
Samtec Inc. FOLC-150-M1-L-Q-LC	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock	0.075 in
Samtec Inc. FOLC-150-04-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-L4-S-Q-LC	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.18 in	Black	Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square	Board Lock	0.12 in
Samtec Inc. FOLC-150-M2-S-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.185 in	Black	Surface Mount Through Hole	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	30 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square		0.12 in
Samtec Inc. FOLC-150-02-L-Q	0.05 in	Solder	125 °C	-55 °C	Receptacle	All	Push-Pull	Tin	0.178 in	Black	Surface Mount	UL94 V-0	Board	200	2.6 A	Gold	4	0.05 in	Female Socket	10 µin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Square