PMCPB5530X,115
ActiveNexperia USA Inc.
20 V, COMPLEMENTARY TRENCH MOSFET
PMCPB5530X,115
ActiveNexperia USA Inc.
20 V, COMPLEMENTARY TRENCH MOSFET
Description
General part information
PMCPB5530X Series
Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless ultra thin DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMCPB5530X,115 |
|---|---|
| Configuration | N, P-Channel |
| Current - Continuous Drain (Id) (Ta) | 4 A |
| Current - Continuous Drain (Id) (Ta) (2) | 3.4 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Gate Charge (Max) | 21.7 nC |
| Input Capacitance (Ciss) (Max) | 660 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-UFDFN Exposed Pad |
| Package Length | 2 mm |
| Package Name | 6-HUSON |
| Package Width | 2 mm |
| Power - Max | 490 mW |
| Rds On (Max) | 34 mOhm |
| Vgs(th) (Max) | 900 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Using power MOSFETs in parallel
Power MOSFET frequently asked questions and answers
Questions about package outline drawings
LFPAK MOSFET thermal design guide, Chinese version
LFPAK MOSFET thermal design guide - Part 2
Nexperia package poster
Power MOSFET single-shot and repetitive avalanche ruggedness rating
plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Understanding power MOSFET data sheet parameters
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Reflow soldering profile
Thermal performance of DFN packages
RC Thermal Models
Failure signature of Electrical Overstress on Power MOSFETs
Understanding power MOSFET data sheet parameters
DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation
MOSFET load switch PCB with thermal measurement
Automatic Optical Inspection of DFN Components