Specification	10018784-10110TLF

Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Nylon, Polyamide, PA, Glass Filled
Mounting Type	Through Hole
Number of Positions	36
Number of Rows	2
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-55 °C
Pitch	0.039 in
Read Out	Dual
Termination	Staggered, Solder

10018784 Series

Part	Color	Contact Material	Mounting Type	Read Out	Operating Temperature (Min)	Operating Temperature (Max)	Contact Type	Number of Positions	Card Thickness	Gender	Termination	Contact Finish	Number of Rows	Contact Finish Thickness	Contact Finish Thickness (string set options)	Contact Finish Thickness	Pitch	Features	Card Type	Material - Insulation	Number of Bay
Amphenol ICC (FCI) 10018784-10213TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	164	0.062 in	Female	Solder Staggered	Gold	2	0	Flash	Flash	0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10001TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	11 64	0.062 in	Female	Solder Staggered	Gold	2	30 µin			0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide	21
Amphenol ICC (FCI) 10018784-11103TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	164	0.062 in	Female	Solder Staggered	Gold	2	15 µin			0.039 in	Board Lock Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10003TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	164	0.062 in	Female	Solder Staggered	Gold	2	30 µin			0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10202MLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C		98	0.062 in	Female	Solder Staggered	Gold Gold GXT™	2	0	Flash	Flash	0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10101TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	11 64	0.062 in	Female	Solder Staggered	Gold	2	15 µin			0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide	21
Amphenol ICC (FCI) 10018784-00102TLF	White	Copper Alloy	Through Hole	Dual	-55 °C	85 °C		98	0.062 in	Female	Solder Staggered	Gold Gold GXT™	2	15 µin			0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10212TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	98	0.062 in	Female	Solder	Gold	2	0	Flash	Flash	0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-11010TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	36	0.062 in	Female	Solder Staggered	Gold	2	30 µin			0.039 in	Board Lock Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide
Amphenol ICC (FCI) 10018784-10112TLF	Black	Copper Alloy	Through Hole	Dual	-55 °C	85 °C	Cantilever	98	0.062 in	Female	Solder	Gold	2	15 µin			0.039 in	Board Guide Locking Ramp	PCI Express™	Glass Filled Nylon PA Polyamide

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10018784-10110TLF | Datasheet