10018784 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN PCI EXP FMALE 164POS 0.039
| Part | Color | Contact Material | Mounting Type | Read Out | Operating Temperature (Min) | Operating Temperature (Max) | Contact Type | Number of Positions | Card Thickness | Gender | Termination | Contact Finish | Number of Rows | Contact Finish Thickness | Contact Finish Thickness (string set options) | Contact Finish Thickness | Pitch | Features | Card Type | Material - Insulation | Number of Bay |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 164 | 0.062 in | Female | Solder Staggered | Gold | 2 | 0 | Flash | Flash | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | |
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 11 64 | 0.062 in | Female | Solder Staggered | Gold | 2 | 30 µin | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | 21 | ||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 164 | 0.062 in | Female | Solder Staggered | Gold | 2 | 15 µin | 0.039 in | Board Lock Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | |||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 164 | 0.062 in | Female | Solder Staggered | Gold | 2 | 30 µin | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | |||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | 98 | 0.062 in | Female | Solder Staggered | Gold Gold GXT™ | 2 | 0 | Flash | Flash | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | ||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 11 64 | 0.062 in | Female | Solder Staggered | Gold | 2 | 15 µin | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | 21 | ||
Amphenol ICC (FCI) | White | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | 98 | 0.062 in | Female | Solder Staggered | Gold Gold GXT™ | 2 | 15 µin | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | ||||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 98 | 0.062 in | Female | Solder | Gold | 2 | 0 | Flash | Flash | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | |
Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 36 | 0.062 in | Female | Solder Staggered | Gold | 2 | 30 µin | 0.039 in | Board Lock Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide | |||
 Amphenol ICC (FCI) | Black | Copper Alloy | Through Hole | Dual | -55 °C | 85 °C | Cantilever | 98 | 0.062 in | Female | Solder | Gold | 2 | 15 µin | 0.039 in | Board Guide Locking Ramp | PCI Express™ | Glass Filled Nylon PA Polyamide |