ESQT-120-03-H-S-348

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Samtec Inc.

CONN SOCKET 20POS 0.079 GOLD PCB

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ESQT-120-03-H-S-348

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Samtec Inc.

CONN SOCKET 20POS 0.079 GOLD PCB

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-120-03-H-S-348

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post	2.79 mm
Contact Length - Post [x]	0.11 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	8.84 mm
Insulation Height	0.348 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-120 Series

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Part	Fastening Type	Contact Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Style	Termination	Insulation Material	Insulation Height	Insulation Height	Row Spacing - Mating	Row Spacing - Mating	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Number of Positions Loaded	Mounting Type	Number of Rows	Number of Positions	Insulation Color	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Post	Contact Length - Post	Contact Finish - Post	Contact Material	Connector Type	Contact Shape	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height [z]	Insulation Height [z]	Number of Positions Loaded
Samtec Inc. ESQT-120-02-G-D-745	Push-Pull	Forked	3 µin	0.076 µm	Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	18.92 mm	0.745 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.51 µm	20 µin	2.67 mm	0.105 in	Gold	Phosphor Bronze	Elevated Socket	Square
Samtec Inc. ESQT-120-03-G-D-370	Push-Pull	Forked	3 µin	0.076 µm	Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	9.4 mm	0.37 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.51 µm	20 µin			Gold	Phosphor Bronze	Elevated Socket	Square	2.23 mm	0.088 in
Samtec Inc. ESQT-120-02-G-D-450	Push-Pull	Forked	3 µin	0.076 µm	Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	11.43 mm	0.45 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.51 µm	20 µin			Gold	Phosphor Bronze	Elevated Socket	Square	10.16 mm	0.4 in
Samtec Inc. ESQT-120-02-L-D-565	Push-Pull	Forked			Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	14.35 mm	0.565 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.25 çm	10 çin			Tin	Phosphor Bronze	Elevated Socket	Square	7.24 mm	0.285 in
Samtec Inc. ESQT-120-03-G-D-313	Push-Pull	Forked	3 µin	0.076 µm	Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	7.95 mm	0.313 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.51 µm	20 µin	3.68 mm	0.145 in	Gold	Phosphor Bronze	Elevated Socket	Square
Samtec Inc. ESQT-120-02-F-D-550	Push-Pull	Forked			Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	13.97 mm	0.55 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.076 µm	3 µin			Tin	Phosphor Bronze	Elevated Socket	Square	7.62 mm	0.3 "
Samtec Inc. ESQT-120-03-F-D-370	Push-Pull	Forked			Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	9.4 mm	0.37 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.076 µm	3 µin			Tin	Phosphor Bronze	Elevated Socket	Square	2.23 mm	0.088 in
Samtec Inc. ESQT-120-03-L-Q-390-001	Push-Pull	Forked			Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)			0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm		Through Hole		80	Black	-55 °C	125 °C	0.25 çm	10 çin	1.73 mm	0.068 in	Tin	Phosphor Bronze	Elevated Socket	Square			9.91 mm	0.39 in	79
Samtec Inc. ESQT-120-02-M-D-680	Push-Pull	Forked			Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	17.27 mm	0.68 in	0.079 in	2 mm	4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	2	40	Black	-55 °C	125 °C	0.51 µm	20 µin	4.32 mm	0.17 in	Tin	Phosphor Bronze	Elevated Socket	Square
Samtec Inc. ESQT-120-03-H-S-348	Push-Pull	Forked	3 µin	0.076 µm	Board to Board Cable	Solder	Liquid Crystal Polymer (LCP)	8.84 mm	0.348 in			4.5 A	UL94 V-0	Gold	0.079 in	2 mm	All	Through Hole	1	20	Black	-55 °C	125 °C	0.76 Ám	30 Áin	2.79 mm		Gold	Phosphor Bronze	Elevated Socket	Square		0.11 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	14	$ 11.30

Description

General part information

ESQT-120 Series

20 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available