
RB095T-40NZC9
ActiveRohm Semiconductor
40V, 6A, ITO-220AB, SCHOTTKY BARRIER DIODE

RB095T-40NZC9
ActiveRohm Semiconductor
40V, 6A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RB095 Series
RB095BGE-30 is low VFschottky barrier diode for general rectification. This is a high-reliability product of automotive grade qualified to AEC-Q101.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB095T-40NZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 6 A |
| Current - Reverse Leakage | 100 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Basics of Thermal Resistance and Heat Dissipation
How to Select Reverse Current Protection Diodes for LDO Regulators
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Condition of Soldering / Land Pattern Reference
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models
Package Dimensions
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Two-Resistor Model for Thermal Simulation
Precautions When Measuring the Rear of the Package with a Thermocouple
Judgment Criteria of Thermal Evaluation
What Is Thermal Design
Taping Information
RB095T-40NZ ESD Data
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Calculating Power Consumption:Static Operation
What is a Thermal Model? (Diode)
Diode Types and Applications
Diode Selection Method for Asynchronous Converter
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Method for Monitoring Switching Waveform
Part Explanation
Inner Structure
Moisture Sensitivity Level - Diodes
How to Create Symbols for PSpice Models
Notes for Temperature Measurement Using Thermocouples
Explanation for Marking
Measurement Method and Usage of Thermal Resistance RthJC
How to Use LTspice® Models: Tips for Improving Convergence
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Power Loss and Thermal Design of Diodes
Certificate of not containing SVHC under REACH Regulation
Impedance Characteristics of Bypass Capacitor
PCB Layout Thermal Design Guide
Compliance of the RoHS directive
RB095T-40NZ Data Sheet
List of Diode Package Thermal Resistance
About Export Regulations
Anti-Whisker formation - Diodes
About Flammability of Materials
Reliability Test Result
Absolute Maximum Rating and Electrical Characteristics of Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Select Rectifier Diodes