
RBR3L60ADDTE25
ActiveRohm Semiconductor
LOW VF, 60V, 3A, DO-214AC (SMA), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

RBR3L60ADDTE25
ActiveRohm Semiconductor
LOW VF, 60V, 3A, DO-214AC (SMA), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
Description
General part information
RBR3L60ADD Series
RBR3L60ADD is the high reliability Automotive Schottky Barrier Diode, suitable for general rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBR3L60ADDTE25 |
|---|---|
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 100 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SMA, DO-214AC |
| Package Name | PMDS |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 660 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Diode Types and Applications
Method for Monitoring Switching Waveform
Absolute Maximum Rating and Electrical Characteristics of Diodes
RBR3L60ADD Data Sheet
How to Select Reverse Current Protection Diodes for LDO Regulators
Basics of Thermal Resistance and Heat Dissipation
Precautions When Measuring the Rear of the Package with a Thermocouple
Report of SVHC under REACH Regulation
Power Loss and Thermal Design of Diodes
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Select Rectifier Diodes
How to Use the Thermal Resistance and Thermal Characteristics Parameters
PCB Layout Thermal Design Guide
Package Dimensions
Measurement Method and Usage of Thermal Resistance RthJC
Inner Structure
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Judgment Criteria of Thermal Evaluation
RBR3L60ADD ESD Data
Reliability Test Result
About Export Regulations
List of Diode Package Thermal Resistance
Anti-Whisker formation - Diodes
Condition of Soldering / Land Pattern Reference
What is a Thermal Model? (Diode)
Importance of Probe Calibration When Measuring Power: Deskew
Constitution Materials List
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Explanation for Marking
About Flammability of Materials
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design
Notes for Calculating Power Consumption:Static Operation
How to Use LTspice® Models: Tips for Improving Convergence
Diode Selection Method for Asynchronous Converter
Taping Information
Moisture Sensitivity Level - Diodes
Two-Resistor Model for Thermal Simulation
How to Create Symbols for PSpice Models
Notes for Temperature Measurement Using Thermocouples
Compliance of the RoHS directive
Part Explanation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Use LTspice® Models
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Method for Calculating Junction Temperature from Transient Thermal Resistance Data