M2S050S-1FG896I

Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 896FBGA

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Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 896FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	M2S050S-1FG896I

Architecture	MCU, FPGA
Connectivity	CANbus, USB, Ethernet, SPI, UART/USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	256 KB
Number of I/O	377 I/O
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	896-BGA
Peripherals	DDR, PCIe, SERDES
Primary Attributes	50 MIPS
RAM Size	64 KB
Speed	166 MHz
Supplier Device Package	896-FBGA (31x31)

Part	Connectivity	Core Processor	Operating Temperature [Max]	Operating Temperature [Min]	Primary Attributes	Speed	RAM Size	Package / Case	Architecture	Peripherals	Supplier Device Package	Flash Size	Number of I/O
Microsemi Corporation M2S050S-1FGG484I	CANbus Ethernet I2C SPI UART/USART USB	ARM® Cortex®-M3	100 °C	-40 C	50 MIPS	166 MHz	64 KB	484-BGA	MCU FPGA	DDR PCIe SERDES	484-FPBGA (23x23)	256 KB	267 I/O
Microsemi Corporation M2S050S-1FG896I	CANbus Ethernet I2C SPI UART/USART USB	ARM® Cortex®-M3	100 °C	-40 C	50 MIPS	166 MHz	64 KB	896-BGA	MCU FPGA	DDR PCIe SERDES	896-FBGA (31x31)	256 KB	377 I/O
Microsemi Corporation M2S050S-1FGG896I	CANbus Ethernet I2C SPI UART/USART USB	ARM® Cortex®-M3	100 °C	-40 C	50 MIPS	166 MHz	64 KB	896-BGA	MCU FPGA	DDR PCIe SERDES	896-FBGA (31x31)	256 KB	377 I/O

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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General part information

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 50K Logic Modules 166MHz 896-FBGA (31x31)

Technical documentation and resources