1N4682UR-1

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Microchip Technology

ZENER DIODE SINGLE 2-PIN 2.7V, 5%, 500MW DO-213AA BAG

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Documents1N4679URthru1N47717 Product Change Notice EN

1N4682UR-1

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Microchip Technology

ZENER DIODE SINGLE 2-PIN 2.7V, 5%, 500MW DO-213AA BAG

Deep-Dive with AI

Documents1N4679URthru1N47717 Product Change Notice EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	1N4682UR-1	1N4682 Series

Current - Reverse Leakage @ Vr	1 µA	1 µA
Mounting Type	Surface Mount	Surface Mount, Through Hole
Operating Temperature [Max]	347 °F	347 °F
Operating Temperature [Min]	-65 ░C	-65 ░C
Package / Case	DO-213AA	DO-213AA, Axial, DO-35, DO-204AH
Power - Max [Max]	500 mW	500 mW
Supplier Device Package	DO-213AA	DO-213AA, DO-204AH (DO-35)
Tolerance	5 %	5 %
Voltage - Forward (Vf) (Max) @ If [Max]	1.5 V	1.5 V
Voltage - Zener (Nom) (Vz)	2.7 V	2.7 V

1N4682 Series

Zener Diode Single 2-Pin 2.7V, 5%, 500mW DO-213AA Bag

Part	Current - Reverse Leakage @ Vr	Operating Temperature [Min]	Operating Temperature [Max]	Supplier Device Package	Tolerance	Voltage - Forward (Vf) (Max) @ If [Max]	Mounting Type	Package / Case	Power - Max [Max]	Voltage - Zener (Nom) (Vz)
Microchip Technology 1N4682UR-1	1 µA	-65 ░C	347 °F	DO-213AA	5 %	1.5 V	Surface Mount	DO-213AA	500 mW	2.7 V
Microchip Technology 1N4682	1 µA			DO-204AH (DO-35)	5 %	1.5 V	Through Hole	Axial, DO-204AH, DO-35	500 mW	2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	186	$ 4.41
Microchip Direct	N/A	1	$ 4.75
Newark	Each	100	$ 4.41
		500	$ 4.23

Description

General part information

1N4682 Series

The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener voltage regulators provides a selection from 1.8 to 43 volts. Standard tolerance is +/-5%, with 1% and 2% options available. The Zener test current is only 50 uA. The metal slugs that sandwich the die are metallurgically bonded to the silicon for high reliability. This type of internally bonded Zener package construction is also available with high-reliability up screening as described in the Features section. Microchip also offers numerous other Zener products to meet higher and lower power applications.

Documents

Technical documentation and resources

1N4679URthru1N47717

Data Sheets

Product Change Notice EN

Datasheet