HMTSW-150-08-G-T-250

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 150 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

HMTSW-150-08-G-T-250

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 150 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Description Specifications Series Pricing CAD Documents

Description

General part information

HMTSW-150 Series

Connector Header Through Hole 150 position 0.100" (2.54mm)

Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-150-08-G-T-250

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	3 µin
Contact Length - Mating	0.25 in
Contact Length - Post	0.18 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	150
Number of Positions Loaded	All
Number of Rows	3
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.53 in
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board, Board or Cable
Termination	Solder

HMTSW-150 Series

Part	Contact Length - Mating	Insulation Color	Contact Finish - Post	Contact Material	Pitch - Mating	Insulation Material	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Number of Rows	Material Flammability Rating	Termination	Mounting Type	Overall Contact Length	Insulation Height	Current Rating	Contact Length - Post	Shrouding	Contact Finish - Mating	Fastening Type	Number of Positions Loaded	Connector Type	Contact Shape	Style	Contact Type	Contact Finish Thickness - Mating	Row Spacing - Mating	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. HMTSW-150-08-L-S-320	0.32 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	50	125 °C	-55 °C	1	UL94 V-0	Solder	Through Hole	0.53 in	0.1 in	3 A	0.11 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin
Samtec Inc. HMTSW-150-07-T-D-240	0.24 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	100	105 °C	-55 °C	2	UL94 V-0	Solder	Through Hole	0.43 in	0.1 in	3 A	0.09 in	Unshrouded	Tin	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin		0.1 in
Samtec Inc. HMTSW-150-12-S-D-840	0.84 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	100	125 °C	-55 °C	2	UL94 V-0	Solder	Through Hole	1.03 in	0.1 in	3 A	0.09 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	30 µin	0.1 in
Samtec Inc. HMTSW-150-08-T-S-387	0.387 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	50	105 °C	-55 °C	1	UL94 V-0	Solder	Through Hole	0.53 in	0.1 in	3 A	0.043 in	Unshrouded	Tin	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin
Samtec Inc. HMTSW-150-22-G-T-440	0.44 in	Natural	Gold	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	150	125 °C	-55 °C	3	UL94 V-0	Solder	Through Hole	0.63 in	0.1 in	3 A	0.09 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in	3 µin
Samtec Inc. HMTSW-150-08-G-T-250	0.25 in	Natural	Gold	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	150	125 °C	-55 °C	3	UL94 V-0	Solder	Through Hole	0.53 in	0.1 in	3 A	0.18 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in	3 µin
Samtec Inc. HMTSW-150-07-G-D-007	0.007 in	Natural	Gold	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	100	125 °C	-55 °C	2	UL94 V-0	Solder	Through Hole	0.43 in	0.1 in	3 A	0.323 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in	3 µin
Samtec Inc. HMTSW-150-28-G-T-500-001	0.5 in	Natural	Gold	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	150	125 °C	-55 °C	3	UL94 V-0	Solder	Through Hole	1.13 in	0.1 in	3 A	0.53 in	Unshrouded	Gold	Push-Pull		Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in	3 µin	149
Samtec Inc. HMTSW-150-08-L-D-230	0.23 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	100	125 °C	-55 °C	2	UL94 V-0	Solder	Through Hole	0.53 in	0.1 in	3 A	0.2 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in
Samtec Inc. HMTSW-150-07-LM-D-240	0.24 in	Natural	Tin	Phosphor Bronze	0.1 in	Liquid Crystal Polymer (LCP)	100	125 °C	-55 °C	2	UL94 V-0	Solder	Through Hole	0.43 in	0.1 in	3 A	0.09 in	Unshrouded	Gold	Push-Pull	All	Header	Square	Board Board or Cable	Male Pin	10 µin	0.1 in

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

HMTSW-150-08-G-T-250 | Datasheet

Datasheet