
BSC028N06NSSCATMA1
ActiveOPTIMOS™ N-CHANNEL POWER MOSFET 60 V ; SUPERSO8 5X6 SUPER COOL PACKAGE; 2.8 MOHM;
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BSC028N06NSSCATMA1
ActiveOPTIMOS™ N-CHANNEL POWER MOSFET 60 V ; SUPERSO8 5X6 SUPER COOL PACKAGE; 2.8 MOHM;
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Technical Specifications
Parameters and characteristics for this part
| Specification | BSC028N06NSSCATMA1 |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 100 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On, Min Rds On) | 6 V, 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 10 V, 49 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 3375 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 8-PowerTDFN |
| Power Dissipation (Max) | 83 W, 2.5 W |
| Rds On (Max) @ Id, Vgs [Max] | 2.8 mOhm |
| Supplier Device Package | PG-TDSON-8-7 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 3.23 | |
| 10 | $ 2.10 | |||
| 100 | $ 1.46 | |||
| 500 | $ 1.19 | |||
| 1000 | $ 1.10 | |||
| 2000 | $ 1.05 | |||
| Digi-Reel® | 1 | $ 3.23 | ||
| 10 | $ 2.10 | |||
| 100 | $ 1.46 | |||
| 500 | $ 1.19 | |||
| 1000 | $ 1.10 | |||
| 2000 | $ 1.05 | |||
| Tape & Reel (TR) | 4000 | $ 1.05 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 3.04 | |
| 10 | $ 2.16 | |||
| 25 | $ 1.94 | |||
| 50 | $ 1.74 | |||
| 100 | $ 1.52 | |||
| 250 | $ 1.37 | |||
| 500 | $ 1.23 | |||
| 1000 | $ 1.14 | |||
Description
General part information
BSC028 Series
OptiMOS™ 5 60 V power MOSFETsinSuperSO8 DSC (dual-side cooling)package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint. SuperSO8 DSC allows excellent thermal performance with two paths for heat dissipation (bottom through PCB + top through exposed clip and heatsink). About 30% of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB. Thus,
Documents
Technical documentation and resources
No documents available