
UPT15RE3/TR13
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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UPT15RE3/TR13
Active5V – 48V POWERMITE1, SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS
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Technical Specifications
Parameters and characteristics for this part
Specification | UPT15RE3/TR13 |
---|---|
Applications | General Purpose |
Current - Peak Pulse (10/1000µs) | 5.77 A |
Mounting Type | Surface Mount |
Operating Temperature [Max] | 150 °C |
Operating Temperature [Min] | -65 °C |
Package / Case | DO-216AA |
Power - Peak Pulse | 1000 W |
Power - Peak Pulse | 1 kW |
Power Line Protection | False |
Supplier Device Package | Powermite 1 (DO216-AA) |
Type | Zener |
Unidirectional Channels [custom] | 1 |
Voltage - Breakdown (Min) [Min] | 16.7 V |
Voltage - Clamping (Max) @ Ipp [Max] | 26 V |
Voltage - Reverse Standoff (Typ) | 15 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
Digikey | Tape & Reel (TR) | 12000 | $ 0.66 | |
Microchip Direct | N/A | 1 | $ 0.71 | |
100 | $ 0.66 | |||
500 | $ 0.63 | |||
1000 | $ 0.59 |
UPT15R-e3 Series
5V – 48V Powermite1, Surface Mount Transient Voltage Suppressors
Part | Power - Peak Pulse | Power - Peak Pulse | Voltage - Reverse Standoff (Typ) | Mounting Type | Voltage - Breakdown (Min) [Min] | Package / Case | Power Line Protection | Applications | Type | Unidirectional Channels [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Clamping (Max) @ Ipp [Max] | Current - Peak Pulse (10/1000µs) | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology UPT15RE3/TR13 | 1000 W | 1 kW | 15 V | Surface Mount | 16.7 V | DO-216AA | General Purpose | Zener | 1 | 150 °C | -65 °C | 26 V | 5.77 A | Powermite 1 (DO216-AA) |
Description
General part information
UPT15R-e3 Series
Microchip’s unique and new Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions. Both unidirectional and bidirectional configurations are available. In addition to its size advantages, the Powermite package includes a fully metallic bottom (anode) side that eliminates the possibility of solder flux entrapment at assembly and a unique locking tab design serves as an integral heat sink. Its innovative design makes this device fully compatible for use with automatic insertion equipment
Documents
Technical documentation and resources
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