1109800-10

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	1109800-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Programmable
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	2 x 5
Number of Positions or Pins (Grid) [custom]	10
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

Part	Contact Finish - Post	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish - Mating	Contact Material - Mating	Features
Aries Electronics 1109800-10	Tin-Lead	Solder	Brass	200 µin	5.08 µm	1 A	Through Hole	10 çin	0.25 çm	2 x 5	10	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	2.54 mm	0.1 in	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	Gold	Beryllium Copper	Programmable

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$