RGT8TM65DGC9
NRNDRohm Semiconductor
5ΜS SHORT-CIRCUIT TOLERANCE, 650V 4A, FRD BUILT-IN, TO-220NFM, FIELD STOP TRENCH IGBT
RGT8TM65DGC9
NRNDRohm Semiconductor
5ΜS SHORT-CIRCUIT TOLERANCE, 650V 4A, FRD BUILT-IN, TO-220NFM, FIELD STOP TRENCH IGBT
Description
General part information
RGT8TM65D Series
RGT8TM65D is a Field Stop Trench IGBT with low collector - emitter saturation voltage, suitable for General Inverter, UPS, Power Conditioner, Welder.
Technical Specifications
Parameters and characteristics for this part
| Specification | RGT8TM65DGC9 |
|---|---|
| Current - Collector (Ic) (Max) | 5 A |
| Current - Collector Pulsed (Icm) | 12 A |
| Gate Charge | 13.5 nC |
| IGBT Type | Trench Field Stop |
| Input Type | Standard |
| Mounting Type | Through Hole |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220NFM |
| Power - Max | 16 VA |
| Reverse Recovery Time (trr) | 40 ns |
| Td (off) @ 25°C | 69 ns |
| Td (on) @ 25°C | 17 ns |
| Test Condition Current | 4 A |
| Test Condition Resistance | 50 Ohm |
| Test Condition Voltage | 400 V |
| Test Condition Voltage (Secondary) | 15 V |
| Vce(on) (Max) | 2.1 V |
| Voltage - Collector Emitter Breakdown (Max) | 650 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Datasheet
Precautions for Thermal Resistance of Insulation Sheet
What Is Thermal Design
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Use LTspice® Models
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Judgment Criteria of Thermal Evaluation
4 Steps for Successful Thermal Designing of Power Devices
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
PCB Layout Thermal Design Guide
Calculation of Power Dissipation in Switching Circuit
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Moisture Sensitivity Level
Notes for Calculating Power Consumption:Static Operation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Estimation of switching losses in IGBTs operating with resistive load
Part Explanation
Compliance of the ELV directive
Importance of Probe Calibration When Measuring Power: Deskew
Precautions When Measuring the Rear of the Package with a Thermocouple
About Export Administration Regulations (EAR)
Impedance Characteristics of Bypass Capacitor
Package Dimensions
About Flammability of Materials
What is a Thermal Model? (IGBT)
Anti-Whisker formation
Types and Features of Transistors
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Temperature Measurement Using Thermocouples
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
Measurement Method and Usage of Thermal Resistance RthJC
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Use LTspice® Models: Tips for Improving Convergence
Two-Resistor Model for Thermal Simulation
How to Create Symbols for PSpice Models
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Basics of Thermal Resistance and Heat Dissipation