
IRLL2705TRPBF
ActivePOWER MOSFET, N CHANNEL, 55 V, 3.8 A, 0.04 OHM, SOT-223, SURFACE MOUNT
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IRLL2705TRPBF
ActivePOWER MOSFET, N CHANNEL, 55 V, 3.8 A, 0.04 OHM, SOT-223, SURFACE MOUNT
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRLL2705TRPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 3.8 A |
| Drain to Source Voltage (Vdss) | 55 V |
| Drive Voltage (Max Rds On, Min Rds On) [Max] | 4 V |
| Drive Voltage (Max Rds On, Min Rds On) [Min] | 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs [Max] | 48 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 870 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | TO-261AA, TO-261-4 |
| Power Dissipation (Max) | 1 W |
| Rds On (Max) @ Id, Vgs | 40 mOhm |
| Supplier Device Package | SOT-223 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 16 V |
| Vgs(th) (Max) @ Id | 2 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.38 | |
| 10 | $ 0.87 | |||
| 100 | $ 0.58 | |||
| 500 | $ 0.45 | |||
| 1000 | $ 0.41 | |||
| Digi-Reel® | 1 | $ 1.38 | ||
| 10 | $ 0.87 | |||
| 100 | $ 0.58 | |||
| 500 | $ 0.45 | |||
| 1000 | $ 0.41 | |||
| Tape & Reel (TR) | 2500 | $ 0.37 | ||
| 5000 | $ 0.34 | |||
| 7500 | $ 0.33 | |||
| 12500 | $ 0.33 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 1.27 | |
| 10 | $ 0.90 | |||
| 25 | $ 0.82 | |||
| 50 | $ 0.74 | |||
| 100 | $ 0.67 | |||
| 250 | $ 0.63 | |||
| 500 | $ 0.59 | |||
| 1000 | $ 0.53 | |||
Description
General part information
IRLL2705 Series
The IRLL2705TRPBF is a HEXFET® fifth generation single N-channel Power MOSFET utilizes advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient and reliable operation. The package is designed for surface-mount using vapour phase, infrared or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heat sinking. Power dissipation of 1W is possible in a typical surface-mount application.
Documents
Technical documentation and resources