Zenode.ai Logo
Beta
K
IRLL2705TRPBF - INFINEON IRLL2705TRPBF

IRLL2705TRPBF

Active
Infineon Technologies

POWER MOSFET, N CHANNEL, 55 V, 3.8 A, 0.04 OHM, SOT-223, SURFACE MOUNT

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
IRLL2705TRPBF - INFINEON IRLL2705TRPBF

IRLL2705TRPBF

Active
Infineon Technologies

POWER MOSFET, N CHANNEL, 55 V, 3.8 A, 0.04 OHM, SOT-223, SURFACE MOUNT

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationIRLL2705TRPBF
Current - Continuous Drain (Id) @ 25°C3.8 A
Drain to Source Voltage (Vdss)55 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]48 nC
Input Capacitance (Ciss) (Max) @ Vds870 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-261AA, TO-261-4
Power Dissipation (Max)1 W
Rds On (Max) @ Id, Vgs40 mOhm
Supplier Device PackageSOT-223
TechnologyMOSFET (Metal Oxide)
Vgs (Max)16 V
Vgs(th) (Max) @ Id2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.38
10$ 0.87
100$ 0.58
500$ 0.45
1000$ 0.41
Digi-Reel® 1$ 1.38
10$ 0.87
100$ 0.58
500$ 0.45
1000$ 0.41
Tape & Reel (TR) 2500$ 0.37
5000$ 0.34
7500$ 0.33
12500$ 0.33
NewarkEach (Supplied on Cut Tape) 1$ 1.27
10$ 0.90
25$ 0.82
50$ 0.74
100$ 0.67
250$ 0.63
500$ 0.59
1000$ 0.53

Description

General part information

IRLL2705 Series

The IRLL2705TRPBF is a HEXFET® fifth generation single N-channel Power MOSFET utilizes advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient and reliable operation. The package is designed for surface-mount using vapour phase, infrared or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heat sinking. Power dissipation of 1W is possible in a typical surface-mount application.

Documents

Technical documentation and resources