RBR20T30ANZC9
ActiveRohm Semiconductor
LOW VF, 30V, 20A, ITO-220AB, SCHOTTKY BARRIER DIODE
RBR20T30ANZC9
ActiveRohm Semiconductor
LOW VF, 30V, 20A, ITO-220AB, SCHOTTKY BARRIER DIODE
Description
General part information
RBR20 Series
RBR20NS30AFHis the high reliability Automotive Schottky Barrier Diode, suitable for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBR20T30ANZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 10 A |
| Current - Reverse Leakage | 200 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Judgment Criteria of Thermal Evaluation
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
How to Create Symbols for PSpice Models
How to Use LTspice® Models: Tips for Improving Convergence
ESD Data
How to Use LTspice® Models
Taping Information
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Notes for Calculating Power Consumption:Static Operation
Notes for Temperature Measurement Using Thermocouples
About Export Regulations
Method for Monitoring Switching Waveform
Power Loss and Thermal Design of Diodes
Diode Types and Applications
PCB Layout Thermal Design Guide
What Is Thermal Design
Anti-Whisker formation - Diodes
About Flammability of Materials
Two-Resistor Model for Thermal Simulation
What is a Thermal Model? (Diode)
Package Dimensions
Impedance Characteristics of Bypass Capacitor
How to Select Reverse Current Protection Diodes for LDO Regulators
Absolute Maximum Rating and Electrical Characteristics of Diodes
Diode Selection Method for Asynchronous Converter
Measurement Method and Usage of Thermal Resistance RthJC
Moisture Sensitivity Level - Diodes
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Compliance of the RoHS directive
Part Explanation
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Constitution Materials List
Certificate of not containing SVHC under REACH Regulation
RBR20T30ANZ Data Sheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Select Rectifier Diodes
Reliability Test Result
Inner Structure
Importance of Probe Calibration When Measuring Power: Deskew
Condition of Soldering / Land Pattern Reference
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
List of Diode Package Thermal Resistance
Explanation for Marking
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Precautions When Measuring the Rear of the Package with a Thermocouple
